HUF76407DK8

Features: • Ultra Low On-Resistance - rDS(ON) = 0.090Ω, VGS = 10V - rDS(ON) = 0.105Ω, VGS = 5V• Simulation Models - Temperature Compensated PSPICE® and SABER© Electrical Models - Spice and SABER Thermal Impedance Models - www.semi.Intersil.com• Peak Current v...

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HUF76407DK8 Picture
SeekIC No. : 004367363 Detail

HUF76407DK8: Features: • Ultra Low On-Resistance - rDS(ON) = 0.090Ω, VGS = 10V - rDS(ON) = 0.105Ω, VGS = 5V• Simulation Models - Temperature Compensated PSPICE® and SABER© Electr...

floor Price/Ceiling Price

Part Number:
HUF76407DK8
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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268 Transactions

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Upload time: 2024/5/31

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Product Details

Description



Features:

• Ultra Low On-Resistance
          - rDS(ON) = 0.090Ω, VGS = 10V
          - rDS(ON) = 0.105Ω, VGS = 5V
• Simulation Models
          - Temperature Compensated PSPICE® and SABER© Electrical Models
          - Spice and SABER Thermal Impedance Models
          - www.semi.Intersil.com
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• Transient Thermal Impedance Curve vs Board Mounting Area
• Switching Time vs RGS Curves



Specifications

Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . VDSS 60 V
Drain to Gate Voltage (RGS = 20kΩ) (Note 1) .. . . . . . . . . . . . VDGR 60 V
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . VGS ±16 V
Drain Current    
Continuous (TC = 25, VGS = 5V). . . . .. . . . . ID 3.5 A
Continuous (TC = 25, VGS = 10V) (Figure 2) . . . . . . . . . . . . ID 3.8 A
Continuous (TC= 100, VGS = 5V) . . . . . . . . . . . . . . . ID 1.0 A
Continuous (TC= 100, VGS = 4.5V) (Figure 2) . . . . . . . . . . . ID 1.0 A
Pulsed Drain Current . . . . . . . . . . . . . . . . . IDM Figure 4  
Pulsed Avalanche Rating . . . . . . . . . . . . . . . UIS Figures 6, 17, 18  
Power Dissipation . . . . . . .. . . . . . PD
2.5 W
Derate Above . . . . . . . . . . . . .25 20 W/
Operating and Storage Temperature . . . . . TJ, TSTG -55 to 150
Maximum Temperature for Soldering    
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . TL 300
Package Body for 10s, See Techbrief TB334. . . . . . . . Tpkg 260



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