HUF76132SK8

MOSFET

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HUF76132SK8 Picture
SeekIC No. : 00165400 Detail

HUF76132SK8: MOSFET

floor Price/Ceiling Price

Part Number:
HUF76132SK8
Mfg:
Fairchild Semiconductor
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/5/31

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Product Details

Quick Details

Transistor Polarity : N-Channel Drain-Source Breakdown Voltage : 30 V
Gate-Source Breakdown Voltage : +/- 20 V Continuous Drain Current : 11.5 A
Resistance Drain-Source RDS (on) : 0.016 Ohms Configuration : Single Quad Drain Triple Source
Maximum Operating Temperature : + 150 C Mounting Style : SMD/SMT
Package / Case : SOP-8    

Description

Packaging :
Transistor Polarity : N-Channel
Gate-Source Breakdown Voltage : +/- 20 V
Mounting Style : SMD/SMT
Drain-Source Breakdown Voltage : 30 V
Maximum Operating Temperature : + 150 C
Configuration : Single Quad Drain Triple Source
Continuous Drain Current : 11.5 A
Resistance Drain-Source RDS (on) : 0.016 Ohms
Package / Case : SOP-8


Features:

• Logic Level Gate Drive
• 11.5A, 30V
• Simulation Models
         - Temperature Compensated PSPICE® and SABER© Electrical Models
         - Spice and SABER™ Thermal Impedance Models
         - www.Intersil.com
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• Transient Thermal Impedance Curve vs Board Mounting Area
• Related Literature
         - TB334, "Guidelines for Soldering Surface Mount Components to PC Boards"



Specifications

 

Drain to Source Voltage (Note 1). . . . . . . . . . . . . . . . VDSS 30 V
Drain to Gate Voltage (RGS = 20kΩ) (Note 1) . . . . . . . . . . .VDGR 30 V
Gate to Source Voltage . . . . . . . . . . . . VGS ±16 V
Drain Current    
Continuous (TA= 25, VGS = 10V) (Figure 2) (Note 2) . . . . ID
11.5 A
Continuous (TA= 100, VGS = 5V) (Note 3) . . . . . . . . . . ID 3.3 A
Continuous (TA= 100, VGS = 4.5V) (Note 3) . . . . . . . . ID 3.2 A
Pulsed Drain Current . . . . . . .. . . . . IDM Figure 4  
Pulsed Avalanche Rating. . . . . . . . . . EAS Figures 6, 17, 18  
Power Dissipation(Note 2) . . . . . . . . . . . . . . . . . PD
2.5 W
Derate Above 25 . . . . . . . . . . . . . . . . . . 20 W/
Operating and Storage Temperature . . . . . . . . . . . TJ, TSTG -55 to 150
Maximum Temperature for Soldering    
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . TL 300
Package Body for 10s, See Techbrief 334. . . . . . . .Tpkg 260




Description

This N-Channel power MOSFET HUF76132SK8 is manufactured using the innovative UltraFET™ process. This advanced process technology achieves the lowest possible on-resistance per silicon area, resulting in outstanding performance. This device is capable of withstanding high energy in the avalanche mode and the diode exhibits very low reverse recovery time and stored charge. HUF76132SK8 was designed for use in applications where power efficiency is important, such as switching regulators, switching converters, motor drivers, relay drivers, low-voltage bus switches, and power management in portable and batteryoperated products.

Formerly developmental type TA76131.


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