HUF76113DK8

MOSFET

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HUF76113DK8 Picture
SeekIC No. : 00166334 Detail

HUF76113DK8: MOSFET

floor Price/Ceiling Price

Part Number:
HUF76113DK8
Mfg:
Fairchild Semiconductor
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/21

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Product Details

Quick Details

Transistor Polarity : N-Channel Drain-Source Breakdown Voltage : 30 V
Gate-Source Breakdown Voltage : +/- 20 V Continuous Drain Current : 6 A
Resistance Drain-Source RDS (on) : 0.032 Ohms Configuration : Dual Dual Drain
Maximum Operating Temperature : + 150 C Mounting Style : SMD/SMT
Package / Case : SOP-8    

Description

Packaging :
Transistor Polarity : N-Channel
Gate-Source Breakdown Voltage : +/- 20 V
Mounting Style : SMD/SMT
Drain-Source Breakdown Voltage : 30 V
Maximum Operating Temperature : + 150 C
Continuous Drain Current : 6 A
Configuration : Dual Dual Drain
Resistance Drain-Source RDS (on) : 0.032 Ohms
Package / Case : SOP-8


Features:

• Logic Level Gate Drive
• 6A, 30V
• Ultra Low On-Resistance, rDS(ON) = 0.032Ω
• Temperature Compensating PSPICE® Model
• Temperature Compensating SABER™ Model
• Thermal Impedance SPICE Model
• Thermal Impedance SABER Model
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• Related Literature
         - TB334, "Guidelines for Soldering Surface Mount Components to PC Boards"



Specifications

Drain to Source Voltage (Note 1). . . . . . . . . . . . . VDSS 30 V
Drain to Gate Voltage (RGS = 20kΩ) (Note 1) . . . . . . . .VDGR 30 V
Gate to Source Voltage . . . . . . . . . . . . VGS ±16 V
Drain Current    
Continuous (TA= 25, VGS = 10V) (Figure 2)(Note 2). . . . ID
6 A
Continuous (TA= 100, VGS = 5V) (Note 3) . . . . . . . . . . ID 1.8 A
Continuous (TA= 100, VGS = 4.5V)(Note 3) . . .. . . . . . ID 1.7 A
Pulsed Drain Current . . . . . . .. . . . . IDM Figure 4  
Pulsed Avalanche Rating. . . . . . . . . . EAS Figures 6  
Power Dissipation(Note 2) . . . . . . . . .. . . . PD
2.5 W
Derate Above 25 . . . . . . . . . . . . . . . . . . 0.02 W/
Operating and Storage Temperature . . . . . . . . . . . TJ, TSTG -55 to 150
Maximum Temperature for Soldering    
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . TL 300
Package Body for 10s, See Techbrief 334. . . . . . . .Tpkg 260



Description

This N-Channel power MOSFET HUF76113DK8 is manufactured using the innovative UltraFET process. This advanced process technology achieves the lowest possible on-resistance per silicon area, resulting in outstanding performance. This device is capable of withstanding high energy in the avalanche mode and the diode exhibits very low reverse recovery time and stored charge. HUF76113DK8 was designed for use in applications where power efficiency is important, such as switching regulators, switching converters, motor drivers, relay drivers, low-voltage bus switches, and power management in portable and batteryoperated products.

Formerly developmental type TA76113.



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