HUF75945S3ST

MOSFET TO-263

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HUF75945S3ST Picture
SeekIC No. : 00166280 Detail

HUF75945S3ST: MOSFET TO-263

floor Price/Ceiling Price

Part Number:
HUF75945S3ST
Mfg:
Fairchild Semiconductor
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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268 Transactions

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Upload time: 2024/11/21

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Product Details

Quick Details

Transistor Polarity : N-Channel Drain-Source Breakdown Voltage : 200 V
Gate-Source Breakdown Voltage : +/- 20 V Continuous Drain Current : 38 A
Resistance Drain-Source RDS (on) : 0.071 Ohms Configuration : Single
Maximum Operating Temperature : + 175 C Mounting Style : SMD/SMT
Package / Case : TO-263AB Packaging : Reel    

Description

Transistor Polarity : N-Channel
Gate-Source Breakdown Voltage : +/- 20 V
Configuration : Single
Maximum Operating Temperature : + 175 C
Mounting Style : SMD/SMT
Packaging : Reel
Drain-Source Breakdown Voltage : 200 V
Continuous Drain Current : 38 A
Package / Case : TO-263AB
Resistance Drain-Source RDS (on) : 0.071 Ohms


Features:

• Ultra Low On-Resistance
- rDS(ON) = 0.071Ω, VGS = 10V
• Simulation Models
- Temperature Compensated PSPICE® and SABER Electrical Models
- Spice and SABER Thermal Impedance Models
- www.fairchildsemi.com
• Peak Current vs Pulse Width Curve
• UIS Rating Curve



Specifications

Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . VDSS 200 V
Drain to Gate Voltage (RGS = 20kΩ) (Note 1) .. . . . . . . . . . . . VDGR 200 V
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . VGS ±20 V
Drain Current    
Continuous (TC = 25, VGS = 10V) (Figure 2) . . . . .. . . . . ID 38 A
Continuous (TC = 100, VGS = 10V) (Figure 2) . . . . . . . . . . . . ID 27 A
Pulsed Drain Current . . . . . . . . . . . . . . . . . IDM Figure 4  
Pulsed Avalanche Rating . . . . . . . . . . . . . . . UIS Figures 6, 14, 15  
Power Dissipation . . . . . . .. . . . . . PD
310 W
Derate Above . . . . . . . . . . . . .25 2.07 W/
Operating and Storage Temperature . . . . . TJ, TSTG -55 to 175
Maximum Temperature for Soldering    
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . TL 300
Package Body for 10s, See Techbrief TB334. . . . . . . . Tpkg 260



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