ApplicationThese products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors´ customers using or selling these products for use in such applications do so...
HT2MOA3S20: ApplicationThese products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philip...
SeekIC Buyer Protection PLUS - newly updated for 2013!
268 Transactions
All payment methods are secure and covered by SeekIC Buyer Protection PLUS.
1 Objective of the Specifications
This specification lists the parameters to be fulfilled by the HITAG 2 chip module HT2MOA3S20 for contactless smart cards or similar transponders (as e.g. discs).
2 Definition of the Chip Module
A chip module is an electronically packaged chip covered with a globe top cap. The HT2MOA3S20 is above all used as card module, i.e. for further lamination into contactless smart cards according to ISO 10536.1.
So the HITAG 2 chip module HT2MOA3S20 is best suited for customers that do not want to spend time with micro assembly and therefore start - e.g. ISO card production - with the HITAG 2 chip module.
3 Use of the Modules
The HITAG 2 modules HT2MOA3S20 are designed to be connected to a coil and then to be further processed by packaging into a transponder (e.g. lamination into an ISO smart card). Specific processing information for the coil-module connection and packaging is given in the specification. For production of contactless chip cards it is recommended to prepunch card foils to create a recess for the chip module in the card body.