HT2MOA3S20

1 Objective of the Specifications
This specification lists the parameters to be fulfilled by the HITAG 2 chip module HT2MOA3S20 for contactless smart cards or similar transponders (as e.g. discs).

2 Definition of the Chip Module
A chip module is an electronically packaged chip covered with a globe top cap. The HT2MOA3S20 is above all used as card module, i.e. for further lamination into contactless smart cards according to ISO 10536.1.

So the HITAG 2 chip module HT2MOA3S20 is best suited for customers that do not want to spend time with micro assembly and therefore start - e.g. ISO card production - with the HITAG 2 chip module.

3 Use of the Modules
The HITAG 2 modules HT2MOA3S20 are designed to be connected to a coil and then to be further processed by packaging into a transponder (e.g. lamination into an ISO smart card). Specific processing information for the coil-module connection and packaging is given in the specification. For production of contactless chip cards it is recommended to prepunch card foils to create a recess for the chip module in the card body.