HSU88

Features: · Low capacitance. (C=0.8pF max)· Low forward voltage.· Ultra small Resin Package (URP) is suitablefor high density surface mounting and high speed assembly.PinoutSpecifications Item Symbol Value Unit Reverse voltage VR 10 V Average rectified current IO ...

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HSU88 Picture
SeekIC No. : 004366509 Detail

HSU88: Features: · Low capacitance. (C=0.8pF max)· Low forward voltage.· Ultra small Resin Package (URP) is suitablefor high density surface mounting and high speed assembly.PinoutSpecifications Ite...

floor Price/Ceiling Price

Part Number:
HSU88
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/3/13

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Product Details

Description



Features:

· Low capacitance. (C=0.8pF max)
· Low forward voltage.
· Ultra small Resin Package (URP) is suitablefor high density surface mounting and high speed assembly.





Pinout

  Connection Diagram




Specifications

Item
Symbol
Value
Unit
Reverse voltage
VR
10
V
Average rectified current
IO
15
mA
Junction temperature
Tj
125
Storage temperature
Tstg
55 to 125





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