Features: • High Brightness AlInGaP Material• Industry Standard 2.00 x 1.25 mm Package• Industry Standard 1.6 x 0.8 mm (Low Profile) Package• Right Angle Package• Three Colors Available• Diffused Optics• Compatible with IR Solder Process• Available i...
HSMx-S660: Features: • High Brightness AlInGaP Material• Industry Standard 2.00 x 1.25 mm Package• Industry Standard 1.6 x 0.8 mm (Low Profile) Package• Right Angle Package• Three...
SeekIC Buyer Protection PLUS - newly updated for 2013!
268 Transactions
All payment methods are secure and covered by SeekIC Buyer Protection PLUS.
Features: • Industry standard PLCC-4• High reliability LED package• High brightn...
Parameter |
HSMx-S660 |
HSMx-S670 |
HSMx-S690 |
Units |
DC Forward Current [1][2][3][4] |
30 |
30 |
30 |
mA |
Power Dissipation |
81 |
81 |
81 |
mW |
Reverse Voltage (IR = 100 A) |
5 |
5 |
5 |
V |
Operating Temperature Range |
-40 to +85 |
-40 to +85 |
-40 to +85 |
|
Storage Temperature Range |
-40 to +100 |
-40 to +100 |
-40 to +100 |
Notes:
1. Derate linearly as shown in Figure 4.
2. Drive currents between 1 mA and 30 mA are recommended for best long term performance.
3. Operating at currents below 1 mA is not recommended. Please contact your Agilent representative for urther information.
4. Maximum temperature for tape and reel packaging is 60.
These chip-type LEDs HSMx-S660 utilize aluminum indium gallium phosphide (AlInGaP) material technology. The AlInGaP material has a very high luminous efficiency, capable of producing high light output over a wide range of drive currents. The 590 nm amber, 605 nm orange, and 626 nm red colors are available in three compact, low profile packages.
The HSMx-S670 is the industry standard 2.0 x 1.25 mm package, and is an excellent all around package.
The HSMx-S690 is the industry standard 1.6 x 0.8 mm package. Its low 0.7 mm profile and wide viewing angle make this LED excellent for backlighting applications. The HSMx-S660 right angle, 3.0 x 2.0 x 1.0 mm LED is optimum for side lighting applications where direct backlighting is not practical.
All HSMx-S660 packages are compatible with IR and convective reflow soldering processes.