HSMS-H670

DescriptionThe HSMS-H670 is designed as a revolutionary concept to the world of LEDs. The internal flip chip construction eliminates the wire bond between the chip and printed circuit board. Consequently as a result of the robust construction, product reliability is greatly improved. Typical appli...

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SeekIC No. : 004366376 Detail

HSMS-H670: DescriptionThe HSMS-H670 is designed as a revolutionary concept to the world of LEDs. The internal flip chip construction eliminates the wire bond between the chip and printed circuit board. Consequ...

floor Price/Ceiling Price

Part Number:
HSMS-H670
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/10/17

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Product Details

Description



Description

The HSMS-H670 is designed as a revolutionary concept to the world of LEDs. The internal flip chip construction eliminates the wire bond between the chip and printed circuit board. Consequently as a result of the robust construction, product reliability is greatly improved. Typical applications include keypad backlighting, LCD backlighting, symbol backlighting and front panel indicator. It adheres to the industry standard 2.0x1.25 mm footprint and is intended for designs where space is limited. The small size, low 1.1mm profile and wide viewing angle make these LEDs excellent for backlighting applications and front panel illumination.

HSMS-H670 has eight features. (1)Umproved reliability through elimination of internal wire bond. (2)-40°C to 85°C operating temperature range. (3)Small size. (4)Industry standard footprint. (5)Diffused optics. (6)Compatible with IR solder process. (7)Four colors available. (8)Available in 8mm tape on 7'' (178mm) diameter reels. Those are all the main features.

Some HSMS-H670 absolute maximum ratings have been concluded into several points as follow. (1)Its DC forward current would be 20mA. (2)Its power dissipation would be 50mW. (3)Its reverse voltage at Ir=100uA would be 5V. (4)Its operating temperature range would be from -40°C to 85°C. (5)Its storage temperature range would be from -40°C to 85°C. It should be noted that stresses above those listed in absolute maximum ratings may cause permanent damage to device.

Also some electrical characteristics of HSMS-H670 are concluded as follow. (1)Its color is high efficiency red. (2)Its forward voltage at If=20mA would be typ 2.0V and max 2.6V. (3)Its reverse breakdown voltage at Ir=100uA would be min 5V. (4)Its capacitance would be typ 6pF with conditions of Vf=0V and f=1MHz. (5)Its thermal resistance would be 250°C/W. And so on. At present we have not got so much information about this IC and we would try hard to get more information about it. If you have any question or suggestion or want to know more information please contact us for details. Thank you!




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