HSMP-386x

Features:

• Unique Configurations in Surface Mount Packages
  Add Flexibility
  Save Board Space
  Reduce Cost
• Switching
  Low Distortion Switching
  Low Capacitance
• Attenuating
  Low Current Attenuating for Less Power Consumption
• Matched Diodes for Consistent Performance
• Better Thermal Conductivity for Higher Power Dissipation
• Low Failure in Time (FIT) Rate^[1]
• Lead-free Option Available

Note:
1. For more information see the Surface Mount PIN Reliability Data Sheet.


Specifications

Symbol	Parameter	Unit	SOT-23	SOT-323
If	Forward Current (1 s Pulse)	Amp	1	1
PIV	Peak Inverse Voltage	V	50	50
Tj	Junction Temperature	°C	150	150
Tstg	Storage Temperature	°C	-65 to 150	-65 to 150
jc	Thermal Resistance[2]	°C/W	500	150

Notes:
1. Operation in excess of any one of these conditions may result in permanent damage to the device.
2. T_C = +25°C, where T_C is defined to be the temperature at the package pins where contact is made to the circuit board.


Description

The HSMP-386x series of general purpose PIN diodes are designed for two classes of applications. The first is attenuators where current consumption is the most important design consideration. The second application for this series of diodes is in switches where low capacitance is the driving issue for the designer.

The HSMP-386x series Total Capacitance (C_T) and Total Resistance (R_T) are typical specifications. For applications that require guaranteed performance, the general purpose HSMP-383x series is recommended.

A SPICE model is not available for PIN diodes as SPICE does not provide for a key PIN diode characteristic, carrier lifetime.