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HSMD-T400

Features: • Compatible with Automatic Placement Equipment• Compatible with Infrared and Vapor Phase Reflow Solder Processes• Packaged in 12mm or 8mm tape on 7 or 13 Diameter Reels• EIA Standard Package• Low Package Profile• Nondiffused Package Excellent for Ba...

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HSMD-T400: Features: • Compatible with Automatic Placement Equipment• Compatible with Infrared and Vapor Phase Reflow Solder Processes• Packaged in 12mm or 8mm tape on 7 or 13 Diameter Reel...

HSMD-T400 Data Sheet

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Part Number:
HSMD-T400
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/24

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Product Details

Description



Features:

• Compatible with Automatic Placement Equipment
• Compatible with Infrared and Vapor Phase Reflow Solder Processes
• Packaged in 12mm or 8mm tape on 7" or 13" Diameter Reels
• EIA Standard Package
• Low Package Profile
• Nondiffused Package Excellent for Backlighting and Coupling to Light Pipes


Specifications

DC Forward
Current[1]		 30 30 30 30 30 30 mA
Peak Forward
Current[2]		 300 90 90 60 90 90 mA
Average
Forward
Current[2]		 20 25 25 20 25 25 mA
LED Junction
Temperature		 95 °C
Transient
Forward
Current[3]
(10 µs Pulse)		 500 mA
Reverse Voltage
(IR = 100 mA)		 5 V
Operating
Temperature
Range		 -40 to +85 -20 to +85 °C
Storage
Temperature
Range		 -40 to +85 °C
Reflow Soldering
Temperature
Convective IR
Vapor Phase 		235°C Peak, above 185°C for 90 seconds.
215°C for 3 minutes.



Description

These solid state surface mount indicators HSMD-T400 are designed with a flat top and sides to be easily handled by automatic placement equipment. A glue pad is provided for adhesive mounting processes. They are compatible with convective IR and vapor phase reflow soldering and conductive epoxy attachment processes.

The HSMD-T400 package size and configura-tion conform to the EIA-535 BAAC standard specification for case size 3528 tantalum capacitors. The folded leads permit dense placement and provide an external solder joint for ease of inspection.

These devices HSMD-T400 are nondiffused,providing high intensity for applications such as backlighting,light pipe illumination, and front panel indication.




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