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HSM123

Features: • Low capacitance, proof against high voltage.• Fast recovery time.• MPAK package is suitable for high density surface mounting and high speed assembly.Specifications Item Symbol Value Unit Peak reverse voltage VRM 85 V Reverse voltage VR...

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SeekIC No. : 004366143 Detail

HSM123: Features: • Low capacitance, proof against high voltage.• Fast recovery time.• MPAK package is suitable for high density surface mounting and high speed assembly.Specifications ...

HSM123 Data Sheet

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Part Number:
HSM123
Supply Ability:
5000

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  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

• Low capacitance, proof against high voltage.
• Fast recovery time.
• MPAK package is suitable for high density surface mounting and high speed assembly.


Specifications

Item
Symbol
Value
Unit
Peak reverse voltage
VRM
85
V
Reverse voltage
VR
80
V
Peak forward current
IFM
300
mA
Non-Repetitive peak forward surge current
IFSM*
4
A
Average forward current
I o
100
mA
Junction temperature
Tj
125
°C
Storage temperature
Tstg
-55 to +125
°C
* Within 1s forward surge current.
** Per one device


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