Features: • Low forward resistance. (rf = 0.5 max)• LLD package is suitable for high density surface mounting and high speed assembly.Specifications Item Symbol Value Unit Reverse voltage VR 35 V Forward current IF 100 mA Power dissipation Pd...
HSK277: Features: • Low forward resistance. (rf = 0.5 max)• LLD package is suitable for high density surface mounting and high speed assembly.Specifications Item Symbol Value Unit ...
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Item |
Symbol |
Value |
Unit |
Reverse voltage |
VR |
35 |
V |
Forward current |
IF |
100 |
mA |
Power dissipation |
Pd |
150 |
mW |
Operation temperature |
Topr |
-20 to + 60 |
°C |
Storage temperature |
Tstg |
-55 to +125 |
°C |