HSB278S

Features: · Low forward voltage, Low capacitance.· CMPAK package is suitable for high density surface mounting and high speed assembly.PinoutSpecifications Item Symbol Value Unit Repetitive peak reverse voltage VRRM 30 V Reverse voltage VR 30 V Non-Repetiti...

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HSB278S Picture
SeekIC No. : 004365921 Detail

HSB278S: Features: · Low forward voltage, Low capacitance.· CMPAK package is suitable for high density surface mounting and high speed assembly.PinoutSpecifications Item Symbol Value Unit Re...

floor Price/Ceiling Price

Part Number:
HSB278S
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/24

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Product Details

Description



Features:

·  Low forward voltage, Low capacitance.
·  CMPAK package is suitable for high density surface mounting and high speed assembly.



Pinout

  Connection Diagram


Specifications

Item
Symbol
Value
Unit
Repetitive peak reverse voltage
VRRM
30
V
Reverse voltage
VR
30
V
Non-Repetitive peak forward surge current
IFSM*1*2
200
mA
Peak forward current
IFS*2
150
mA
Average rectified current
IO*2
30
mA
Junction temperature
Tj
125
Storage temperature
Tstg
-55 to +125
Notes: 1. 10 msec sine wave 1 pulse
Notes: 2. Per one device.


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