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HS-7322

SpecificationsSystem CPU:Intel® Mobile Dual Core processor, supports Merom 65nm and Penryn 45nm (Socket P) FSB:800/1066MHz FSB BIOS:Award PnP Flash BIOS System Chipset:Intel® GM45/ICH9-M I/O Chipset:Winbond W83627UHG System Memory:2 x 240-pin DIMM sockets up to 4GB DDR2 SDRAM Storage:1 x T...

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SeekIC No. : 004365843 Detail

HS-7322: SpecificationsSystem CPU:Intel® Mobile Dual Core processor, supports Merom 65nm and Penryn 45nm (Socket P) FSB:800/1066MHz FSB BIOS:Award PnP Flash BIOS System Chipset:Intel® GM45/ICH9-M I/O...

HS-7322 Data Sheet

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Part Number:
HS-7322
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/2/15

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Product Details

Description



Specifications

System
CPU:
Intel® Mobile Dual Core processor, supports Merom 65nm and Penryn 45nm (Socket P)
FSB:
800/1066MHz FSB
BIOS:
Award PnP Flash BIOS
System Chipset:
Intel® GM45/ICH9-M
I/O Chipset:
Winbond W83627UHG
System Memory:
2 x 240-pin DIMM sockets up to 4GB DDR2 SDRAM
Storage:
1 x Type II CF socket
Watchdog Timer:
Software programmable time-out intervals from 1~255 sec.
H/W Status Monitor:
Monitoring temperatures, voltages, and cooling fan status
I/O Interface
MIO:
3 x RS-232
1 x RS-232/422/485
5 x USB2.0 (4 x internal, 1 x external)
1 x Parallel
3 x SATA
1 x PS/2 for KB/MS
GPIO:
8-bit general purpose input/output port
Display
Chipset:
Intel® GM45 integrated Intel® Gen5.0 GMA X4500 Graphics
Display Memory:
384MB video memory
LVDS:
24-bit single channel/48-bit dual channel
DVI-I:
Intel® GMX4500
Resolution:
2048 x 1536
Audio
Chipset:
RealTek ALC262
Audio Interface (w/header):
MIC In, Line Out
Ethernet
Chipset:
Dual RealTek RTL8111C 10/100/1000 Mbps LAN
Ethernet Interface:
RJ-45 x 2
Mechanical & Environmental
Operating Temperature:
0~60 degrees C
Operating Humidity:
0~95%, non-condensing
Size (L x W):
167.64 x 126.39 mm



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