HMPP-386x

These ultra-miniature products represent the blending of Agilent Technologies' proven semiconductor and the latest in leadless packaging technology.

The HMPP-386x series of general purpose PIN diodes are designed for two classes of applications. The first is attenuators where current consumption is the most important design consideration. The second application for this series of diodes is in switches where low capacitance with no reverse bias is the driving issue for the designer.

The low dielectric relaxation frequency of the HMPP-386x insures that low capacitance can be reached at zero volts reverse bias at frequencies above 1 GHz, making this PIN diode ideal for hand held applications.

Low junction capacitance of the PIN diode chip, combined with ultra low package parasitics, mean that these products may be used at frequencies which are higher than the upper limit for conventional PIN diodes.

Note that Agilent's manufacturing techniques assure that dice packaged in pairs are taken from adjacent sites on the wafer, assuring the highest degree of match.

These ultra-miniature products like HMPP-386x represent the blending of Agilent Technologies' proven semiconductor and the latest in leadless packaging technology.

The HMPP-386x series of general purpose PIN diodes are designed for two classes of applications. The first is attenuators where current consumption is the most important design consideration. The second application for this series of diodes is in switches where low capacitance with no reverse bias is the driving issue for the designer.

The low dielectric relaxation frequency of the HMPP-386x insures that low capacitance can be reached at zero volts reverse bias at frequencies above 1 GHz, making this PIN diode ideal for hand held applications.

Low junction capacitance of the PIN diode chip, combined with ultra low package parasitics, mean that these products like HMPP-386x may be used at frequencies which are higher than the upper limit for conventional PIN diodes.

Note that Agilent's manufacturing techniques assure that dice of HMPP-386x packaged in pairs are taken from adjacent sites on the wafer, assuring the highest degree of match.