Features: ·Part Identification HMD8M32M16EB---- 2048 Cycles/32ms Ref. Solder HMD8M32M16EBG-- 2048 Cycles/32ms Ref. Gold·Access times : 50, 60ns·High-density 32MByte design·Single + 5V ±0.5V power supply·JEDEC standard PDpin and pinout·EDO mode operation·TTL compatible inputs and outputs·FR4-PCB de...
HMD8M32M16EBG: Features: ·Part Identification HMD8M32M16EB---- 2048 Cycles/32ms Ref. Solder HMD8M32M16EBG-- 2048 Cycles/32ms Ref. Gold·Access times : 50, 60ns·High-density 32MByte design·Single + 5V ±0.5V power su...
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Features: ·Access times : 50, 60ns·High-density 32MByte design·Single +5V ± 0.5V power supply·JEDE...
Features: ·Part Identification HMD8M32M16--2048 Cycles/32ms Ref, Solder HMD8M32M16G--2048 Cycles/3...
Features: ·Part Identification HMD8M32M16EG- 2048 Cycles/32ms Ref. Gold·Access times : 50, 60ns·Hi...
PARAMETER |
SYMBOL |
RATING |
Voltage on Any Pin Relative to Vss |
VIN ,OUT |
-1V to 7.0V |
Voltage on Vcc Supply Relative to Vss |
Vcc |
-1V to 7.0V |
Power Dissipation |
PD |
16W |
Storage Temperature |
TSTG |
-55 to 150 |
Short Circuit Output Current |
IOS |
50mA |
`Permanent device damage may occur if " Absolute Maximum Ratings" are exceeded. Functional operation should be
restricted to the conditions as detailed in the operational sections of this data sheet. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
The HMD8M32M16EBG is a 8M x 32bit dynamic RAM high density memory module.
The module HMD8M32M16EBG consists of sixteen CMOS 4M x 4bit DRAMs in 24-pin SOJ packages mounted on a 72-pin, double-sided, FR-4-printed circuit board. A 0.1 or 0.22uF decoupling capacitor is mounted on the printed circuit board for each DRAM components.
The module HMD8M32M16EBG is a single In-line Memory Module with edge connections and is intended for mounting in to 72-pin edge connector sockets. All module components may be powered from a single 5V DC power supply and all inputs and outputs are TTL compatible.