HMC659

Features: ·P1dB Output Power: +26.5 dBm·Gain: 19 dB·Output IP3: +35 dBm·Supply Voltage: +8V @ 300 mA·50 Ohm Matched Input/Output·Die Size: 3.115 x 1.630 x 0.1 mmApplicationThe HMC659 is ideal for:·Telecom Infrastructure·Microwave Radio & VSAT·Military & Space·Test Instrumentation·Fiber Opt...

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SeekIC No. : 004364367 Detail

HMC659: Features: ·P1dB Output Power: +26.5 dBm·Gain: 19 dB·Output IP3: +35 dBm·Supply Voltage: +8V @ 300 mA·50 Ohm Matched Input/Output·Die Size: 3.115 x 1.630 x 0.1 mmApplicationThe HMC659 is ideal for:·T...

floor Price/Ceiling Price

Part Number:
HMC659
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/21

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Product Details

Description



Features:

·P1dB Output Power: +26.5 dBm
·Gain: 19 dB
·Output IP3: +35 dBm
·Supply Voltage: +8V @ 300 mA
·50 Ohm Matched Input/Output
·Die Size: 3.115 x 1.630 x 0.1 mm



Application

The HMC659 is ideal for:
 ·Telecom Infrastructure
 ·Microwave Radio & VSAT
 ·Military & Space
 ·Test Instrumentation
 ·Fiber Optics



Specifications

Drain Bias Voltage (Vdd) +9 Vdc
Gate Bias Voltage (Vgg1) 0 to -2 Vdc
Gate Bias Voltage (Vgg2) +2V to +4V
RF Input Power (RFIN)(Vdd = +12V +20 dBm
Channel Temperature 175
Continuous Pdiss (T=85
(derate 41 mW/ above 85
3.69 W
Thermal Resistance
(channel to die bottom)
24.4/W
Storage Temperature -65 to +150
Operating Temperature -55 to +85



Description

The HMC659 is a GaAs MMIC PHEMT Distributed Power Amplii er die which operates between DC and 15 GHz. The HMC659 amplii er provides 19 dB of gain, +35 dBm output IP3 and +26.5 dBm of output power  at 1 dB gain compression while quiring 300 mA from a +8V supply. Gain l atness is excellent at 0.5 dB from DC to 10 GHz making the HMC619 ideal for EW, CM, Radar and test equipment applications.The HMC659 amplii er I/Os are internally matched to 50 ohms facilitating gration into Mutli-ChipModules (MCMs). All data is taken with the chip connected via two 0.025mm (1 mil) wire bonds of minimal length 0.31 mm (12 mils).




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