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HMC607

Features: ·High Isolation: >50 dB @ 10 GHz·Low Insertion Loss: 1.4 dB Typical @ 6.0 GHz·Non-Refl ective Design·Die Size: 2.05 mm x 1.04 mm x 0.1 mmApplication• Telecom Infrastructure• Microwave Radio & VSAT• Military Radios, Radar & ECM• Space Systems• Test...

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HMC607: Features: ·High Isolation: >50 dB @ 10 GHz·Low Insertion Loss: 1.4 dB Typical @ 6.0 GHz·Non-Refl ective Design·Die Size: 2.05 mm x 1.04 mm x 0.1 mmApplication• Telecom Infrastructure•...

HMC607 Data Sheet

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Part Number:
HMC607
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/21

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Product Details

Description



Features:

·High Isolation: >50 dB @ 10 GHz
·Low Insertion Loss: 1.4 dB Typical @ 6.0 GHz
·Non-Refl ective Design
·Die Size: 2.05 mm x 1.04 mm x 0.1 mm


Application

• Telecom Infrastructure
• Microwave Radio & VSAT
• Military Radios, Radar & ECM
• Space Systems
• Test Instrumentation


Specifications

RF Input Power (A, A, B, B = 0/-5V)
(0.5 - 6 GHz)		 +30 dBm (@ +50 )
Control Voltage Range (A, A, B, B) +1.0V to -7.5 Vdc
Channel Temperature 150
Thermal Resistance (RTH)
(junction to lead)		 94 /W
Storage Temperature -65 to +150
Operating Temperature -40 to +85



Description

The HMC607 is a broadband high isolation nonrefl ective GaAs MESFET SPDT MMIC chip. Covering DC to 15 GHz, the switch features >55 dB isolation at lower frequencies and >45 dB at higher frequencies. The HMC607 switch operates using complementary negative control voltage logic lines of -5/0V and requires no bias supply




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