HMC583LP5E

Features: ·Dual Output: Fo = 11.5 - 12.8 GHz Fo/2 = 5.75 - 6.4 GHz·Pout: +11 dBm·Phase Noise: -110 dBc/Hz @100 kHz Typ.·No External Resonator Needed·QFN Leadless SMT Package, 25 mm2ApplicationLow noise MMIC VCO w/Half Frequency, Divide-by-4 Outputs for:·Point to Point/Multipoint Radio·Test Equipm...

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SeekIC No. : 004364273 Detail

HMC583LP5E: Features: ·Dual Output: Fo = 11.5 - 12.8 GHz Fo/2 = 5.75 - 6.4 GHz·Pout: +11 dBm·Phase Noise: -110 dBc/Hz @100 kHz Typ.·No External Resonator Needed·QFN Leadless SMT Package, 25 mm2ApplicationLow n...

floor Price/Ceiling Price

Part Number:
HMC583LP5E
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/21

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Product Details

Description



Features:

·Dual Output:
              Fo = 11.5 - 12.8 GHz
              Fo/2 = 5.75 - 6.4 GHz
·Pout: +11 dBm
·Phase Noise: -110 dBc/Hz @100 kHz Typ.
·No External Resonator Needed
·QFN Leadless SMT Package, 25 mm2



Application

Low noise MMIC VCO w/Half Frequency, Divide-by-4
Outputs for:
·Point to Point/Multipoint Radio
·Test Equipment & Industrial Controls
·SATCOM
·Military End-Use



Specifications

Vcc(Dig), Vcc(Amp), Vcc(RF) +5.5 Vdc
Vtune 0 to +15V
Junction Temperature 135
Continuous Pdiss (T=85
(derate 43.5 mW/ above 85
2.17 W
Thermal Resistance
(junction to ground paddle)
23 /W
Storage Temperature -65 to +150
Operating Temperature -40 to +85
ESD Sensitivity (HBM) Class 1A



Description

The HMC583LP5 & HMC583LP5E are GaAs InGaP Heterojunction Bipolar Transistor (HBT) MMIC VCOs. The HMC583LP5 & HMC583LP5E integrate resonators, negative resistance devices, varactor diodes and feature half frequency and divide-by-4 outputs. The VCOs phase noise performance is excellent ovetemperature, shock, and process due to the scillators monolithic structure. Power output is +11 dBm typical from a +5V supply voltage. The prescaler and RF/2 tions  disabled to conserve current if not required. The voltage controlled oscillator is packaged in a leadless QFN 5x5 mm surface ount package, and requires no external matching components.




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