HMC582LP5

Features: ·Triple Output: Fo = 11.1 - 12.4 GHzFo/2 = 5.55 - 6.2 GHzFo/4 = 2.78 - 3.1 GHz·Pout: +9 dBm·Phase Noise: -110 dBc/Hz @100 kHz Typ.·No External Resonator Needed·QFN Leadless SMT Package, 25 mm2ApplicationLow noise MMIC VCO w/Half Frequency, Divide-by-4 Outputs for:·Point to Point/Multipoi...

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SeekIC No. : 004364270 Detail

HMC582LP5: Features: ·Triple Output: Fo = 11.1 - 12.4 GHzFo/2 = 5.55 - 6.2 GHzFo/4 = 2.78 - 3.1 GHz·Pout: +9 dBm·Phase Noise: -110 dBc/Hz @100 kHz Typ.·No External Resonator Needed·QFN Leadless SMT Package, 25...

floor Price/Ceiling Price

Part Number:
HMC582LP5
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/21

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Product Details

Description



Features:

·Triple Output: Fo = 11.1 - 12.4 GHz
Fo/2 = 5.55 - 6.2 GHz
Fo/4 = 2.78 - 3.1 GHz
·Pout: +9 dBm
·Phase Noise: -110 dBc/Hz @100 kHz Typ.
·No External Resonator Needed
·QFN Leadless SMT Package, 25 mm2





Application

Low noise MMIC VCO w/Half Frequency, Divide-by-4
Outputs for:
·Point to Point/Multipoint Radio
·Test Equipment & Industrial Controls
·SATCOM
·Military End-Use





Specifications

Vcc(Dig), Vcc(Amp), Vcc(RF) +5.5 Vdc
Vtune 0 to +15V
Junction Temperature 135
Continuous Pdiss (T=85 )
(derate 43.5mW/above 85 )
2.17 W
Thermal Resistance
(junction to ground paddle)
23 /W
Storage Temperature -65 to +150
Operating Temperature -40 to +85
ESD Sensitivity (HBM) Class 1A







Description

The HMC582LP5 & HMC582LP5E are GaAs InGaP Heterojunction Bipolar Transistor (HBT) MMIC VCOs. The HMC582LP5 & HMC582LP5E integrate resona-tors, negative resistance devices, varactor diodes and feature half frequency and ideby-4 outputs. The VCOs phase noise performance is excellent ove temperature, shock, and process due to the rsmonolithic structure. Power output is +9 dBm typical from a +5V supply voltage. The prescaler and RF/2 functions can be disabled to conserve current if not required. The voltage controlled oscillator is packaged in a leadless QFN 5x5 mm surface ount package, and requires no external matching components.








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