HMC571LC5

Features: ·9 dB Conversion Gain·Image Rejection: 18 dB·2 LO to RF Isolation: 35 dB·Noise Figure: 3.0 dB·Input IP3: +2 dBm·RoHS Compliant 5×5 mm SMT PackageApplication·Point-to-Point and Point-to-Multi-Point Radio·Military Radar, EW & ELINT·Satellite CommunicationsSpecifications RFLO Drive...

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SeekIC No. : 004364255 Detail

HMC571LC5: Features: ·9 dB Conversion Gain·Image Rejection: 18 dB·2 LO to RF Isolation: 35 dB·Noise Figure: 3.0 dB·Input IP3: +2 dBm·RoHS Compliant 5×5 mm SMT PackageApplication·Point-to-Point and Point-to-Mul...

floor Price/Ceiling Price

Part Number:
HMC571LC5
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/21

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Product Details

Description



Features:

·9 dB Conversion Gain
·Image Rejection: 18 dB
·2 LO to RF Isolation: 35 dB
·Noise Figure: 3.0 dB
·Input IP3: +2 dBm
·RoHS Compliant 5×5 mm SMT Package



Application

·Point-to-Point and Point-to-Multi-Point Radio
·Military Radar, EW & ELINT
·Satellite Communications



Specifications

RF
LO Drive
Vdd
Channel Temperature
+2 dBm
+ 13 dBm
5.5V
175
Continuous Pdiss (T= 85)
(derate 6.99 mW/ above 85)
860mW
Thermal Resistance(RTH)
(channel to ground paddle)
104.6 /W
Storage Temperature
Operating Temperature
-65 to +150
-55 to +85
ESD Sensitivity (HBM) Class 1B



Description

The HMC571LC5 is a compact GaAs MMIC I/Q downconverter in a leadless RoHS compliant SMT package. This device provides a small signal conversion gain of 9 dB with a noise i gure of 3.0 dB and 18 dB of image rejection across the frequency band. The HMC571LC5 utilizes an LNA followed by an image reject mixer which is driven by an active x2 multiplier. The image reject mixer eliminates the need for a i lter following the LNA, and removes thermal noise at the image frequency. I and Q mixer outputs are provided and an external 90 hybrid is needed toselect the required sideband. The HMC571LC5 is a much smaller alternative to hybrid style image reject mixer downconverter assemblies, and it eliminates the need for wire bonding by allowing the use of surface mount manufacturing techniques.




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