HMC569LC5

Features: Conversion Gain: 14 dBImage Rejection: 32 dBLO to RF Isolation: 45 dBNoise Figure: 2.5 dBInput IP3: -0.5 dBmRoHS Compliant 5x5 mm SMT PackageApplicationThe HMC569LC5 is ideal for:• Point-to-Point and Point-to-Multi-Point Radio• Military Radar, EW & ELINT• Satellite ...

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SeekIC No. : 004364253 Detail

HMC569LC5: Features: Conversion Gain: 14 dBImage Rejection: 32 dBLO to RF Isolation: 45 dBNoise Figure: 2.5 dBInput IP3: -0.5 dBmRoHS Compliant 5x5 mm SMT PackageApplicationThe HMC569LC5 is ideal for:• P...

floor Price/Ceiling Price

Part Number:
HMC569LC5
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/21

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Product Details

Description



Features:

Conversion Gain: 14 dB
Image Rejection: 32 dB
LO to RF Isolation: 45 dB
Noise Figure: 2.5 dB
Input IP3: -0.5 dBm
RoHS Compliant 5x5 mm SMT Package



Application

The HMC569LC5 is ideal for:
• Point-to-Point and Point-to-Multi-Point Radio
• Military Radar, EW & ELINT
• Satellite Communications



Specifications

RF +5 dBm
LO Drive +20 dBm
VD1, VD2 4.0V
VD3 5.5V
Channel Temperature 150
Continuous Pdiss (T= 85)
(derate9.56mW/ above 85)
0.65 W
Thermal Resistance (RTH)
(channel to package bottom)
71/W
Storage Temperature -65 to +150
Operating Temperature 55 to +85



Description

The HMC569LC5 is a compact GaAs MCM I/Q downconverter in a leadless RoHS compliant SMT package. This device provides a small signal conversion gain of 14 dB with a noise fi gure of 2.5 dB and 32 dB of image rejection. The HMC569LC5 utilizes an LNA followed by an image reject mixer which is driven by an LO buffer amplifi er. The image reject mixer eliminates the need for a fi lter following the LNA, and removes thermal noise at the image frequency. I and Q mixer outputs are provided and an external 90° hybrid is needed to select the required sideband. The HMC569LC5 is a much smaller alternative to hybrid style image reject mixer downconverter assemblies, and it eliminates the need for wire bonding by allowing the use of surface mount manufacturing techniques.




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