Features: ·Wide IF Bandwidth: DC - 18 GHz·Input IP3: +21 dBm·High LO/RF Isolation: 35 dB·Passive Double Balanced Topology·Compact Size: 1.14mm x 0.59mm x 0.1mmApplication• Test Equipment & Sensors• Microwave Point-to-Point Radios• Point-to-Multi-Point Radios• Military &...
HMC560: Features: ·Wide IF Bandwidth: DC - 18 GHz·Input IP3: +21 dBm·High LO/RF Isolation: 35 dB·Passive Double Balanced Topology·Compact Size: 1.14mm x 0.59mm x 0.1mmApplication• Test Equipment &...
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Features: ·360° of Continuous Phase Control·40 dB of Continuous Gain Control·-162 dBm/Hz Output No...
RF/IF Input | +25 dBm |
LO Drive | +23 dBm |
IF DC Current | ±2 mA |
Channel Temperature | 150 /W |
Continuous Pdiss (T= 85 ) (derate 14.79 mW/ above 85 ) |
0.961 W |
Thermal Resistance (RTH) (channel to die bottom) |
67.6 /W |
Storage Temperature | -65 to +150 |
Operating Temperature | -55 to +85 |
The HMC560 chip is a miniature passive double balanced mixer which is fabricated in a GaAs MESFET process, and can be used as an upconverter or downconverter from 24-40 GHz in a small chip area. The wide bandwidth allows this device to be used across multiple radio bands with a common platform. Excellent isolations are provided by on-chip baluns, and the chip requires no external components and no DC bias. Measurements were made with the HMC560 chip mounted and ribbon bonded into in a 50-ohm microstrip test fi xture. Measured data includes the parasiticeffects of the assembly. RF connections to the chip were made with 0.076mm (3-mil) ribbon bond with minimal length <0.31mm (<12 mil).