HMC560

Features: ·Wide IF Bandwidth: DC - 18 GHz·Input IP3: +21 dBm·High LO/RF Isolation: 35 dB·Passive Double Balanced Topology·Compact Size: 1.14mm x 0.59mm x 0.1mmApplication• Test Equipment & Sensors• Microwave Point-to-Point Radios• Point-to-Multi-Point Radios• Military &...

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SeekIC No. : 004364243 Detail

HMC560: Features: ·Wide IF Bandwidth: DC - 18 GHz·Input IP3: +21 dBm·High LO/RF Isolation: 35 dB·Passive Double Balanced Topology·Compact Size: 1.14mm x 0.59mm x 0.1mmApplication• Test Equipment &...

floor Price/Ceiling Price

Part Number:
HMC560
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/6/6

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Product Details

Description



Features:

·Wide IF Bandwidth: DC - 18 GHz
·Input IP3: +21 dBm
·High LO/RF Isolation: 35 dB
·Passive Double Balanced Topology
·Compact Size: 1.14mm x 0.59mm x 0.1mm



Application

• Test Equipment & Sensors
• Microwave Point-to-Point Radios
• Point-to-Multi-Point Radios
• Military & Space



Specifications

RF/IF Input +25 dBm
LO Drive +23 dBm
IF DC Current ±2 mA
Channel Temperature 150 /W
Continuous Pdiss (T= 85 )
(derate 14.79 mW/ above 85 )
0.961 W
Thermal Resistance (RTH)
(channel to die bottom)
67.6 /W
Storage Temperature -65 to +150
Operating Temperature -55 to +85



Description

The HMC560 chip is a miniature passive double balanced mixer which is fabricated in a GaAs MESFET process, and can be used as an upconverter or downconverter from 24-40 GHz in a small chip area. The wide bandwidth allows this device to be used across multiple radio bands with a common platform. Excellent isolations are provided by on-chip baluns, and the chip requires no external components and no DC bias. Measurements were made with the HMC560 chip mounted and ribbon bonded into in a 50-ohm microstrip test fi xture. Measured data includes the parasiticeffects of the assembly. RF connections to the chip were made with 0.076mm (3-mil) ribbon bond with minimal length <0.31mm (<12 mil).




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