HMC555

Features: ·Wide IF Bandwidth: DC - 3.5 GHz·High Image Rejection: 15 dB·High LO to RF Isolation: 50 dB·High Input IP3: +20 dBm·Passive Topology: No DC Bias Required·Compact Size: 1.49mm x 1.15mm x 0.1mmApplicationThe HMC555 is ideal for:·Microwave Radio·Satellite Communication Systems·Military End ...

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SeekIC No. : 004364238 Detail

HMC555: Features: ·Wide IF Bandwidth: DC - 3.5 GHz·High Image Rejection: 15 dB·High LO to RF Isolation: 50 dB·High Input IP3: +20 dBm·Passive Topology: No DC Bias Required·Compact Size: 1.49mm x 1.15mm x 0....

floor Price/Ceiling Price

Part Number:
HMC555
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/21

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Product Details

Description



Features:

·Wide IF Bandwidth: DC - 3.5 GHz
·High Image Rejection: 15 dB
·High LO to RF Isolation: 50 dB
·High Input IP3: +20 dBm
·Passive Topology: No DC Bias Required
·Compact Size: 1.49mm x 1.15mm x 0.1mm



Application

The HMC555 is ideal for:
·Microwave Radio
·Satellite Communication Systems
·Military End Use
·Test Equipment & Sensors



Specifications

RF Input +19 dBm
IF1 / IF2 Input +24 dBm
LO Drive +27 dBm
Channel Temperature 150
Continuous Pdiss (T=85
(derate 8.95 mW/C above 85
582 mW
Thermal Resistance (RTH )
(channel to die bottom)
111.6/W
Storage Temperature -65 to +150
Operating Temperature -55 to +85
ESD Sensitivity (HBM) Class 1A



Description

The HMC555 is a compact I/Q MMIC mixer which can be used as either an Image Reject Mixer or a Single Sideband rter. The chip utilizes two double balanced mixer cells and a 90 degree hybrid fabricated in a GaAs MESFET process. All data shown below is taken with the chip mounted in a 50 Ohm test i xture and includes the effects of 1 mil diameter x 12 mil length bond wires on each port. A low frequency quadrature hybrid was used to produce a 100 MHz USB IF output. This compact mixer is a much more compact alternative to hybrid style Image Reject Mixers and Single Sideband Upconverter assemblies, and is ideal for microwave radio applications. The redundant IF port connections located on opposing sides of the HMC555 chip, provide added layout l exibility.




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