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HMC464

Features: +26 dBm P1dB Output PowerGain: 16 dB+30 dBm Output IP3Supply Voltage: +8.0V @ 290 mA50 Ohm Matched Input/Output3.12 mm x 1.63 mm x 0.1 mmApplicationThe HMC464 wideband driver is ideal for:• Telecom Infrastructure• Microwave Radio & VSAT• Military & Space• ...

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SeekIC No. : 004364093 Detail

HMC464: Features: +26 dBm P1dB Output PowerGain: 16 dB+30 dBm Output IP3Supply Voltage: +8.0V @ 290 mA50 Ohm Matched Input/Output3.12 mm x 1.63 mm x 0.1 mmApplicationThe HMC464 wideband driver is ideal for:...

HMC464 Data Sheet

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Part Number:
HMC464
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/21

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Product Details

Description



Features:

+26 dBm P1dB Output Power
Gain: 16 dB
+30 dBm Output IP3
Supply Voltage: +8.0V @ 290 mA
50 Ohm Matched Input/Output
3.12 mm x 1.63 mm x 0.1 mm


Application

The HMC464 wideband driver is ideal for:
• Telecom Infrastructure
• Microwave Radio & VSAT
• Military & Space
• Test Instrumentation
• Fiber Optics


Specifications

Drain Bias Voltage (Vdd) +9.0 Vdc
Gate Bias Voltage (Vgg1) -2.0 to 0 Vdc
Gate Bias Voltage (Vgg2) (Vdd -8.0) Vdc to Vdd
RF Input Power (RFin)(Vdd = +8.0 Vdc) +23 dBm
Channel Temperature 175 °C
Continuous Pdiss (T= 85 °C)
(derate 51.5 mW/°C above 85 °C)		 4.64 W
Thermal Resistance
(channel to die bottom)		 19.4 °C/W
Storage Temperature -65 to +150 °C
Operating Temperature -40 to +85 °C



Description

The HMC464 is a GaAs MMIC PHEMT Distributed Power Amplifi er die which operates between 2 and 20 GHz. The amplifi er provides 16 dB of gain, +30 dBm Output IP3 and +26 dBm of output power at 1 dB gain compression while requiring 290 mA from a +8V supply. Gain fl atness is excellent from 2 - 18 GHz making the HMC464 ideal for EW, ECM and radar driver amplifi er applications. The HMC464 amplifi er I/O's are internally matched to 50 Ohms facilitating easy integration into Multi- Chip-Modules (MCMs). All data is with the chip in a 50 Ohm test fi xture connected via 0.025mm (1 mil) diameter wire bonds of minimal length 0.31mm (12 mils).




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