HMC463

Features: Gain: 14 dBNoise Figure: 2.5 dB @ 10 GHzP1dB Output Power: +19 dBm @ 10 GHzSupply Voltage: +5.0V @ 60 mA50 Ohm Matched Input/Output3.15 mm x 1.63 mm x 0.1 mmApplicationThe HMC463 is ideal for:• Telecom Infrastructure• Microwave Radio & VSAT• Military & SpaceR...

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SeekIC No. : 004364090 Detail

HMC463: Features: Gain: 14 dBNoise Figure: 2.5 dB @ 10 GHzP1dB Output Power: +19 dBm @ 10 GHzSupply Voltage: +5.0V @ 60 mA50 Ohm Matched Input/Output3.15 mm x 1.63 mm x 0.1 mmApplicationThe HMC463 is ideal ...

floor Price/Ceiling Price

Part Number:
HMC463
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/21

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Product Details

Description



Features:

Gain: 14 dB
Noise Figure: 2.5 dB @ 10 GHz
P1dB Output Power: +19 dBm @ 10 GHz
Supply Voltage: +5.0V @ 60 mA
50 Ohm Matched Input/Output
3.15 mm x 1.63 mm x 0.1 mm



Application

The HMC463 is ideal for:
• Telecom Infrastructure
• Microwave Radio & VSAT
• Military & Space
• Test Instrumentation
• Fiber Optics



Specifications

Drain Bias Voltage (Vdd) +9.0 Vdc
Gate Bias Voltage (Vgg1) -2.0 to 0 Vdc
Gate Bias Voltage (Vgg2)(AGC) (Vdd -9.0)
Vdc to +2.0 Vdc
RF Input Power (RFin)(Vdd = +5.0 Vdc) +23 dBm
Channel Temperature 175 °C
Continuous Pdiss (T= 85 °C)
(derate 50 mW/°C above 85 °C)
4.5 W
Thermal Resistance
(channel to die bottom)
20 °C/W
Storage Temperature -65 to +150 °C
Operating Temperature -40 to +85 °C



Description

The HMC463 is a GaAs MMIC PHEMT Low Noise AGC Distributed Amplifi er die which operates between 2 and 20 GHz. The amplifi er provides 14 dB of gain, 2.5 dB noise fi gure and 19 dBm of output power at 1 dB gain compression while requiring only 60 mA from a +5V supply. An optional gate bias (Vgg2) is provided to allow Adjustable Gain Control (AGC) of 10 dB typical. Gain fl atness is excellent at ±0.15 dB from 6 - 18 GHz making the HMC463 ideal for EW, ECM and RADAR applications. The HMC463 amplifi er can easily be integrated into Multi-Chip-Modules (MCMs) due to its small size. All data is with the chip in a 50 Ohm test fi xture connected via 0.025mm (1 mil) diameter wire bonds of minimal length 0.31mm (12 mils).




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