HMC462

Features: Noise Figure: 2 dB @ 10 GHzGain: 15 dBP1dB Output Power: +15 dBm @ 10 GHzSelf-Biased: +5.0V @ 63 mA50 Ohm Matched Input/Output3.12 mm x 1.38 mm x 0.1 mmApplicationThe HMC462 Wideband LNA is ideal for:• Telecom Infrastructure• Microwave Radio & VSAT• Military & S...

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SeekIC No. : 004364088 Detail

HMC462: Features: Noise Figure: 2 dB @ 10 GHzGain: 15 dBP1dB Output Power: +15 dBm @ 10 GHzSelf-Biased: +5.0V @ 63 mA50 Ohm Matched Input/Output3.12 mm x 1.38 mm x 0.1 mmApplicationThe HMC462 Wideband LNA i...

floor Price/Ceiling Price

Part Number:
HMC462
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/21

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Product Details

Description



Features:

Noise Figure: 2 dB @ 10 GHz
Gain: 15 dB
P1dB Output Power: +15 dBm @ 10 GHz
Self-Biased: +5.0V @ 63 mA
50 Ohm Matched Input/Output
3.12 mm x 1.38 mm x 0.1 mm



Application

The HMC462 Wideband LNA is ideal for:
• Telecom Infrastructure
• Microwave Radio & VSAT
• Military & Space
• Test Instrumentation
• Fiber Optics



Specifications

Drain Bias Voltage (Vdd) +9.0 Vdc
RF Input Power (RFin)(Vs = +5.0 Vdc)

+23 dBm
Channel Temperature 175 °C
Continuous Pdiss (T= 85 °C)
(derate 50 mW/°C above 85 °C)
4.5 W
Thermal Resistance
(channel to die bottom)
20 °C/W
Storage Temperature -65 to +150 °C
Operating Temperature -40 to +85 °C



Description

The HMC462 is a GaAs MMIC PHEMT Low Noise Distributed Amplifi er die which operates between 2 and 20 GHz. The amplifi er provides 15 dB of gain, 2.0 to 2.5 dB noise fi gure and +15 dBm of output power at 1 dB gain compression while requiring only 63 mA from a single +5V supply. Gain fl atness is excellent at ±0.5 dB from 6 - 18 GHz making the HMC462 ideal for EW, ECM and RADAR applications. The HMC462 requires a single supply of +5V @ 63 mA and is the self-biased version of the HMC463. The wideband amplifi er I/Os are internally matched to 50 Ohms facilitating easy integration into Multi-Chip-Modules (MCMs). All data is with the chip in a 50 Ohm test fi xture connected via 0.025mm (1 mil) diameter wire bonds of minimal length 0.31mm (12 mils).




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