HMC451

Features: Gain: 22 dB Saturated Output Power: +22 dBm @ 24% PAE Output IP3: +30 dBm Single Positive Supply: +5.0 V @ 127 mA 50 Ohm Matched Input/Output Small Size: 1.35 mm x 1.35 mm x 0.1 mmApplicationThe HMC451 is ideal for use as a driver amplifi er for:• Point-to-Point Radios• Poin...

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SeekIC No. : 004364078 Detail

HMC451: Features: Gain: 22 dB Saturated Output Power: +22 dBm @ 24% PAE Output IP3: +30 dBm Single Positive Supply: +5.0 V @ 127 mA 50 Ohm Matched Input/Output Small Size: 1.35 mm x 1.35 mm x 0.1 mmApplica...

floor Price/Ceiling Price

Part Number:
HMC451
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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268 Transactions

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Upload time: 2024/11/21

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Product Details

Description



Features:

Gain: 22 dB
Saturated Output Power: +22 dBm @ 24% PAE
Output IP3: +30 dBm
Single Positive Supply: +5.0 V @ 127 mA
50 Ohm Matched Input/Output
Small Size: 1.35 mm x 1.35 mm x 0.1 mm



Application

The HMC451 is ideal for use as a driver amplifi er for:
• Point-to-Point Radios
• Point-to-Multi-Point Radios & VSAT
• Test Equipment & Sensors
• LO Driver for HMC Mixers
• Military & Space



Specifications

Drain Bias Voltage (Vdd) +5.5 Vdc
RF Input Power (RFin)(Vdd = +5.0 Vdc) +10 dBm
Channel Temperature 175
Continuous Pdiss (T= 85 )
(derate 13 mW/ above 85 )
1.2 W
Thermal Resistance
(channel to die bottom)
75 /W
Storage Temperature -65 to +150
Operating Temperature -55 to +85



Description

The HMC451 is a general purpose GaAs PHEMT MMIC Medium Power Amplifi er which operates between 5.0 and 20.0 GHz. The amplifi er provides 22 dB of gain, +22 dBm of saturated power and 24% PAE from a +5.0 V supply. Consistent gain and output power across the operating band make it possible to use a common driver/LO amplifi er approach in multiple radio bands. The HMC451 amplifi er can easily be integrated into Multi-Chip-Modules (MCMs) due to its small (1.82mm2) size, single supply operation and DC blocked I/Os. All data is tested with the chip in a 50 Ohm test fi xture connected via 0.025mm (1 mil) diameter wire bonds of minimal length <0.31mm (<12 mils).




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