HMC449LC3B

Features: ·Output Power: +9 dBm·Wide Input Power Range: -4 to +6 dBm·Fo Isolation: 30 dBc @ Fout= 28 GHz·100 kHz SSB Phase Noise: -132 dBc/Hz·Single Supply: 5V@ 50 mA·RoHS Compliant 3x3 mm SMT Package ApplicationThe HMC449LC3B is suitable for:• Point-to-Point & Multi-Point Radios•...

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SeekIC No. : 004364075 Detail

HMC449LC3B: Features: ·Output Power: +9 dBm·Wide Input Power Range: -4 to +6 dBm·Fo Isolation: 30 dBc @ Fout= 28 GHz·100 kHz SSB Phase Noise: -132 dBc/Hz·Single Supply: 5V@ 50 mA·RoHS Compliant 3x3 mm SMT Packa...

floor Price/Ceiling Price

Part Number:
HMC449LC3B
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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268 Transactions

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Upload time: 2024/12/21

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Product Details

Description



Features:

·Output Power: +9 dBm
·Wide Input Power Range: -4 to +6 dBm
·Fo Isolation: 30 dBc @ Fout= 28 GHz
·100 kHz SSB Phase Noise: -132 dBc/Hz
·Single Supply: 5V@ 50 mA
·RoHS Compliant 3x3 mm SMT Package






Application

The HMC449LC3B is suitable for:
• Point-to-Point & Multi-Point Radios
• VSAT Radios
• Military EW, ECM, C3I
• Test Instrumentation
• Military & Space





Specifications

RF Input (Vcc= +5V)
Supply Voltage (Vdd)
Channel Temperature
Continuous Pdiss (T= 85 °C)
derate 8.3 mW/°C above 85 °C)
Thermal Resistance
channel to ground paddle)
Storage Temperature
Operating Temperature
+20 dBm
+6.0 Vdc
175 °C
744 mW

121 °C/W

-65 to +150 °C
-40 to +85 °C





Description

The HMC449LC3B is a x2 active broadband frequency multiplier utilizing GaAs PHEMT technology in a leadless RoHS SMT package. When driven by a 0 dBm signal the multiplier provides +9 dBm typicaloutput power from 27 to 31 GHz. The Fo and 3Fo isolations are >25 dBc and >30 dBc respectively at 30 GHz. The HMC449LC3B is ideal for use in LO multiplier chains yielding a reduced parts count vs.traditional approaches. The low additive SSB Phase Noise of -132 dBc/Hz at 100 kHz offset helps maintain good system noise performance. The HMC449LC3B eliminates the need for wire bonding, allowing the use of surface mount manufacturing techniques.






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