HMC449

Features: Output Power: +10 dBmWide Input Power Range: -4 to +6 dBmFo Isolation: 34 dBc @ Fout= 30 GHz100 kHz SSB Phase Noise: -132 dBc/HzSingle Supply: 5V@ 50 mADie Size: 1.10 mm x 1.20 mm x 0.1 mmApplicationThe HMC449 is suitable for:• Pt to Pt & Multi-Pt Radios• VSAT Radios̶...

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SeekIC No. : 004364074 Detail

HMC449: Features: Output Power: +10 dBmWide Input Power Range: -4 to +6 dBmFo Isolation: 34 dBc @ Fout= 30 GHz100 kHz SSB Phase Noise: -132 dBc/HzSingle Supply: 5V@ 50 mADie Size: 1.10 mm x 1.20 mm x 0.1 mm...

floor Price/Ceiling Price

Part Number:
HMC449
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/21

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Product Details

Description



Features:

Output Power: +10 dBm
Wide Input Power Range: -4 to +6 dBm
Fo Isolation: 34 dBc @ Fout= 30 GHz
100 kHz SSB Phase Noise: -132 dBc/Hz
Single Supply: 5V@ 50 mA
Die Size: 1.10 mm x 1.20 mm x 0.1 mm





Application

The HMC449 is suitable for:
• Pt to Pt & Multi-Pt Radios
• VSAT Radios
• Military EW, ECM, C3I
• Test Instrumentation
• Space





Specifications

RF Input (Vcc= +5V) +20 dBm
Supply Voltage (Vd1) +6.0 Vdc
Channel Temperature 175 °C
Continuous Pdiss (T= 85 °C)
(derate 8.3 mW/°C above 85 °C)
744 mW
Thermal Resistance
(junction to die bottom)
121 °C/W
Storage Temperature -65 to +150 °C
Operating Temperature -40 to +85 °C





Description

The HMC449 die is a x2 active broadband frequency multiplier chip utilizing GaAs PHEMT technology. When drThe HMC462 is a GaAs MMIC PHEMT Low Noise Distributed Amplifi er die which operates between 2 and 20 GHz. The amplifi er provides 15 dB of gain, 2.0 to 2.5 dB noise fi gure and +15 dBm of output power at 1 dB gain compression while requiring only 63 mA from a single +5V supply. Gain fl atness is excellent at ±0.5 dB from 6 - 18 GHz making the HMC462 ideal for EW, ECM and RADAR applications. The HMC462 requires a single supply of +5V @ 63 mA and is the self-biased version of the HMC463. The wideband amplifi er I/Os are internally matched to 50 Ohms facilitating easy integration into Multi-Chip-Modules (MCMs). All data is with the chip in a 50 Ohm test fi xture connected via 0.025mm (1 mil) diameter wire bonds of minimal length 0.31mm (12 mils). iven by a 0 dBm signal the multiplier provides +10 dBm typical output power from 28 to 32 GHz. The Fo and 3Fo isolations are >34 dBc and >17 dBc respectively at 30 GHz. The HMC449 is ideal for use in LO multiplier chains yielding a reduced parts count vs. traditional approaches. The low additive SSB Phase Noise of -132 dBc/Hz at 100 kHz offset helps maintain good system noise performance. All data is with the chip in a 50 ohm test fi xture connected via 0.076mm x 0.0127mm (3mil x 0.5mil) ribbon bonds of minimal length 0.31mm (<12mils).






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