HMC448

Features: Output Power: +11 dBmWide Input Power Range: -4 to +6 dBmFo, 3Fo Isolation: >20 dBc @ Fout= 20 GHz100 KHz SSB Phase Noise: -135 dBc/HzSingle Supply: 5V@ 48 mADie Size: 1.16 mm x 1.20 mm x 0.1 mmApplicationThe HMC448 is suitable for:• Clock Generation Applications:SONET OC-192 &a...

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SeekIC No. : 004364072 Detail

HMC448: Features: Output Power: +11 dBmWide Input Power Range: -4 to +6 dBmFo, 3Fo Isolation: >20 dBc @ Fout= 20 GHz100 KHz SSB Phase Noise: -135 dBc/HzSingle Supply: 5V@ 48 mADie Size: 1.16 mm x 1.20 mm...

floor Price/Ceiling Price

Part Number:
HMC448
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/21

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Product Details

Description



Features:

Output Power: +11 dBm
Wide Input Power Range: -4 to +6 dBm
Fo, 3Fo Isolation: >20 dBc @ Fout= 20 GHz
100 KHz SSB Phase Noise: -135 dBc/Hz
Single Supply: 5V@ 48 mA
Die Size: 1.16 mm x 1.20 mm x 0.1 mm





Application

The HMC448 is suitable for:
• Clock Generation Applications:
SONET OC-192 & SDH STM-64
• Pt to Pt & VSAT Radios
• Test Instrumentation
• Military & Space





Specifications

RF Input (Vcc= +5V) +20 dBm
Supply Voltage (Vd1, Vd2) +6.0 Vdc
Channel Temperature 175 °C
Continuous Pdiss (T= 85 °C)
(derate 8.3 mW/°C above 85 °C)
744 mW
Thermal Resistance
(junction to die bottom)
121 °C/W
Storage Temperature -65 to +150 °C
Operating Temperature -40 to +85 °C





Description

The HMC448 die is a x2 active broadband frequency multiplier chip utilizing GaAs PHEMT technology. When driven by a 0 dBm signal, the multiplier provides +11 dBm typical output power from 19 to 25 GHz. The Fo and 3Fo isolations are >22 dBc up to 22 GHz. This multi-rate frequency multiplier can be used in the generation of a half rate clock for 40 Gbps systems or as part of a multiplier chain to generate a full rate 40 Gbps clock. The HMC448 is also ideal for use in LO multiplier chains for Pt to Pt & VSAT Radios yielding reduced parts count vs. traditional approaches. The low additive SSB Phase Noise of -135 dBc/Hz at 100 kHz offset helps maintain good system noise performance. All data is with the chip in a 50 ohm test fi xture connected via 0.076mm x 0.0127mm (3mil x 0.5mil) ribbon bonds of minimal length 0.31mm (<12mils).






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