HMC405

Features: Gain: 16 dBP1dB Output Power: +13 dBmStable Gain Over Temperature50 Ohm I/O'sSmall Size: 0.38 mm x 0.58 mm x 0.1 mmApplicationAn excellent cascadable 50 Ohm Gain Block or LO Driver for:• Microwave & VSAT Radios• Test Equipment• Military EW, ECM, C3I• Space Tel...

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SeekIC No. : 004364003 Detail

HMC405: Features: Gain: 16 dBP1dB Output Power: +13 dBmStable Gain Over Temperature50 Ohm I/O'sSmall Size: 0.38 mm x 0.58 mm x 0.1 mmApplicationAn excellent cascadable 50 Ohm Gain Block or LO Driver for:...

floor Price/Ceiling Price

Part Number:
HMC405
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/5/22

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Product Details

Description



Features:

Gain: 16 dB
P1dB Output Power: +13 dBm
Stable Gain Over Temperature
50 Ohm I/O's
Small Size: 0.38 mm x 0.58 mm x 0.1 mm





Application

An excellent cascadable 50 Ohm Gain Block or LO Driver for:
• Microwave & VSAT Radios
• Test Equipment
• Military EW, ECM, C3I
• Space Telecom





Specifications

Collector Bias Voltage (Vcc) +7.0 Vdc
RF Input Power (RFin)(Vs = +5.0 Vdc) +10 dBm
Junction Temperature 150 °C
Continuous Pdiss (T = 85 °C)
(derate 16 mW/°C above 85 °C)
0.339 W
Thermal Resistance
(junction to ground paddle)
192 °C/W
Storage Temperature -65 to +150 °C
Operating Temperature -55 to +85 °C





Description

The HMC405 die is a GaAs InGaP Heterojunction Bipolar Transistor (HBT) Gain Block MMIC DC to 10 GHz amplifi er. This amplifi er can be used as either a cascadable 50 Ohm gain stage or to drive the LO of HMC mixers with up to +17dBm output power. The HMC405 offers 16 dB of gain and an output IP3 of +32 dBm while requiring only 50 mA from a +5V supply. The Darlington feedback pair used results in reduced sensitivity to normal process variations and yields excellent gain stability over temperature while requiring a minimal number of external bias components. The HMC405 can easily be integrated into Multi-Chip-Modules (MCMs) due to its small (0.22mm2) size. All data is with the chip in a 50 Ohm test fi xture connected via 0.025mm (1 mil) diameter wire bonds of minimal length 0.5mm (20 mils).






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