HGTP10N50F1D

Features: • 10A, 400V and 500V• Latch Free Operation• Typical Fall Time < 1.4ms• High Input Impedance• Low Conduction Loss• Anti-Parallel Diode• tRR < 60nsPinoutSpecificationsCollector-Emitter Voltage . . . . . . . . . . . . . . . . . . . . . . . . ....

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HGTP10N50F1D Picture
SeekIC No. : 004362188 Detail

HGTP10N50F1D: Features: • 10A, 400V and 500V• Latch Free Operation• Typical Fall Time < 1.4ms• High Input Impedance• Low Conduction Loss• Anti-Parallel Diode• tRR <...

floor Price/Ceiling Price

Part Number:
HGTP10N50F1D
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/23

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Product Details

Description



Features:

• 10A, 400V and 500V
• Latch Free Operation
• Typical Fall Time < 1.4ms
• High Input Impedance
• Low Conduction Loss
• Anti-Parallel Diode
• tRR < 60ns



Pinout

  Connection Diagram


Specifications

Collector-Emitter Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BVCES 400 500 V
Collector-Gate Voltage RGE = 1MW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BVCGR 400 500 V
Collector Current Continuous at TC = +25 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  IC25 12 12 A
at TC = +90 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. .IC90 10 10 A
Collector Current Pulsed (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ICM 12 12 A
Gate-Emitter Voltage Continuous. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VGES ±20 ±20 V
Diode Forward Current at TC = +25 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IF25 16 16 A
at TC = +90 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IF90 10 10 A
Power Dissipation Total at TC = +25 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .PD 75 75 W
Power Dissipation Derating TC > +25 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.6 0.6 W/
Operating and Storage Junction Temperature Range . . . . . . .. TJ, TSTG -55 to +150 -55 to +150
Maximum Lead Temperature for Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL 260 260



Description

The HGTP10N50F1D IGBT is a MOS gated high voltage switching device combining the best features of MOSFETs and bipolar transistors. The HGTP10N50F1D has the high input impedance of a MOSFET and the low on-state conduction loss of a bipolar transistor. The much lower on-state voltage drop varies only moderately between +25 and +150. The diode used in parallel with the IGBT is an ultrafast (tRR < 60ns) with soft recovery characteristic.

HGTP10N50F1D IGBTs are ideal for many high voltage switching applications operating at frequencies where low conduction losses are essential, such as: AC and DC motor controls, power supplies and drivers for solenoids, relays and contactors.


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