Features: SpecificationsDescription Features of HERA801G-HERA808G include:Glass passivated chip junction,High efficiency, Low VF High current capability High reliability,High surge current capability,For use in low voltage, high frequency inventor, free wheeling, and polarity protection applicatio...
HERA801G-HERA808G: Features: SpecificationsDescription Features of HERA801G-HERA808G include:Glass passivated chip junction,High efficiency, Low VF High current capability High reliability,High surge current capabilit...
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Features of HERA801G-HERA808G include:Glass passivated chip junction,High efficiency, Low VF High current capability High reliability,High surge current capability,For use in low voltage, high frequency inventor, free wheeling, and polarity protection application.
Mechanical Data of HERA801G-HERA808G include:(1)Cases:TO-220AC Molded plastic;(2)Epoxy: UL 94V0 rate flame retardant;(3)Terminals: Pure tin plated, lead free solderable per MIL-STD-202, Method 208 guaranteed;(4)Polarity: As marked;(5)High temperature soldering guaranteed:260oC/10 seconds .16",(4.06mm) from case.(6)Weight: 2.24 grams.
Here are Maximum Rating and Electrical Characteristics of HERA801G-HERA808G :(1)Maximum Average Forward Rectified Current is 8.0A;(2)Peak Forward Surge Current, 8.3 ms Single Half Sine-wave Superimposed on Rated Load (JEDEC method) is 150A;(3)Maximum DC Reverse Current is 10uA(@TA=25 oC at Rated DC Blocking Voltage) and 400uA(@ TA=125 oC);(4)Maximum Reverse Recovery Time is 50nS(HERA801G.HERA802G.HERA803G.HERA804G.HERA805G);(5)Typical Thermal Resistance is 2.0oC/W;(6)Operating Temperature Range is -65 to +150 oC;(7)Storage Temperature Range is -65 to +150 oC.