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HEP1601

Features: · Plastic package has Underwriters Laboratory Flammability Classification 94V-0· Low forward voltage drop· High current capability· High reliability· Low power loss, high effciency· High surge current capability· High speed switching· Low leakageSpecifications Symbol Type Number H...

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SeekIC No. : 004361440 Detail

HEP1601: Features: · Plastic package has Underwriters Laboratory Flammability Classification 94V-0· Low forward voltage drop· High current capability· High reliability· Low power loss, high effciency· High s...

HEP1601 Data Sheet

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Part Number:
HEP1601
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/18

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Product Details

Description



Features:

· Plastic package has Underwriters Laboratory Flammability Classification 94V-0
· Low forward voltage drop
· High current capability
· High reliability
· Low power loss, high effciency
· High surge current capability
· High speed switching
· Low leakage


Specifications

Symbol Type Number HEP
1601
 HEP
1602

HEP
1603

 HEP
1604		 HEP
1605		 HEP
1606		 UNITS
VRRM Peak reverse voltage, Repetitive; 50 100 200 300 400 600 Volts
VRMS Maximum RMS Vol tage 35 70 140 210 280 420 Volts
VDC Maximum DC Blocki ng Vol tage 50 100 200 300 400 600 Volts
I(AV) Maximum average forward rectified current
0.375"(9.5mm) lead length @ at TA=100		 8.0 Amps
IFSM Peak forward surge current 8.3ms single
half sine-wave superimposed on rated load
(JEDEC method)		 125 Amps
VF Maximum instantaneous forward voltage
at 8.0A		 1.0 1.3 1.7 Volts
IR Maximum DC reverse current at rated DC
blocking voltage TA=25
 10.0 A
Maximum DC reverse current at rated DC
blocking voltage TA=125		 100
Trr Maximum reverse recovery time (Note 1) 50 80 ns
Cj Typical junction capacitance (Note 2) 80 50 pF
RJA Typical thermal resistance (Note 3) 2.2 /W
TJ
TSTG		 Operating junction and storage
temperature range		 -55 to +150
-55 to +150
Notes:
(1) Test conditions: IF=0.5A, IR=1.0A, Irr=0.25A.
(2) Measured at 1MHz and applied reverse voltage of 4.0 Volts.
(3) Thermal resistance from junction to case mounting on heatsink.


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