HD6417760BP200D

Features: Item Features LSI • Operating frequency: 200 MHz • Performance: 360MIPS, 1.4 GFLOPS • Voltage: 1.5 V (internal), 3.3 V (I/O) • Superscalar architecture: Parallel execution of two instructions • Packages: 256...

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SeekIC No. : 004360211 Detail

HD6417760BP200D: Features: Item Features LSI • Operating frequency: 200 MHz • Performance: 360MIPS, 1.4 GFLOPS • Voltage: 1.5 V (internal), 3.3 V (I/O) ...

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Part Number:
HD6417760BP200D
Supply Ability:
5000

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  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
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Product Details

Description



Features:

Item Features
LSI • Operating frequency: 200 MHz
• Performance: 360MIPS, 1.4 GFLOPS
• Voltage: 1.5 V (internal), 3.3 V (I/O)
• Superscalar architecture: Parallel execution of two instructions
• Packages: 256-pin BGA (Size: 21 * 21 mm, pin pitch: 1.0 mm)
• External buses:
 Separate 26-bit address and 32-bit data buses
 External bus frequency: 67MHz
• Choice of MFI mode or LCD mode:
 MFI mode: 8-/16-bit parallel interface
(supports 68-/80-family interface)
 LCD mode: LCD controller/data output
CPU • Original Hitachi SuperH architecture
• 32-bit internal data bus
• General register file:
 Sixteen 32-bit general registers (and eight 32-bit shadow registers)
 Seven 32-bit control registers
 Four 32-bit system registers
• RISC-type instruction set (upward-compatible with SuperH Series)
 Fixed 16-bit instruction length for improved code efficiency
 Load-store architecture
 Delayed branch instructions
 Conditional execution
 C-based instruction set
• Superscalar architecture (providing simultaneous execution of two
instructions) including FPU
• Instruction execution time: Maximum 2 instructions/cycle
• Virtual address space: 4 Gbytes (448-Mbyte external memory space)
• Space identifier ASIDs: 8 bits, 256 virtual address spaces
• On-chip multiplier
• 5-stage pipeline
FPU • On-chip floating-point coprocessor
• Supports single-precision (32 bits) and double-precision (64 bits)
• Supports IEEE754-compliant data types and exceptions
• Two rounding modes: Round to Nearest and Round to Zero
• Handling of denormalized numbers: Truncation to zero or interrupt
generation for compliance with IEEE754
• Floating-point registers: 32 bits * 16 words * 2 banks
• 32-bit CPU-FPU floating-point communication register (FPUL)
• Supports FMAC (multiply-and-accumulate) instruction
• Supports FDIV (divide) and FSQRT (square root) instructions
• Supports FLDI0/FLDI1 (load constant 0/1) instructions
• Instruction execution times:
 Latency (FMAC/FADD/FSUB/FMUL): 3 cycles (single-precision), 8 cycles (double-precision)
 Pitch (FMAC/FADD/FSUB/FMUL): 1 cycle (single-precision), 6 cycles (double-precision)
Note: FMAC is supported for single-precision only.
• 3-D graphics instructions (single-precision only):
 4-dimensional vector conversion and matrix operations (FTRV): 4 cycles (pitch), 7 cycles (latency)
 4-dimensional vector inner product (FIPR): 1 cycle (pitch), 4 cycles (latency)
• 5-stage pipeline
Clock pulse
generator (CPG)
• Choice of main clock: 1, 6, or 12 times EXTAL
• Clock modes:
 CPU frequency: 1, 1/2, 1/3, 1/4, 1/6, or 1/8 times main clock
 Bus frequency: 1, 1/2, 1/3, 1/4, 1/6, or 1/8 times main clock
 Peripheral frequency: 1/2, 1/3, 1/4, 1/6, or 1/8 times main clock
• Power-down modes:
 Sleep mode
 Deep sleep mode
 Standby mode
 Hardware standby mode
 Module standby mode
• Single-channel watchdog timer
Memory
management
unit (MMU)
• 4-Gbyte address space, 256 address space identifiers (8-bit ASIDs)
• Single virtual mode and multiple virtual memory mode
• Supports multiple page sizes: 1 kbyte, 4 kbytes, 64 kbytes, 1 Mbyte
• 4-entry fully-associative TLB for instructions
• 64-entry fully-associative TLB for instructions and operands
• Supports software-controlled replacement and random-counter
replacement algorithm
• TLB contents can be accessed directly by address mapping
Cache memory • Instruction cache (IC)
 16-kbyte, 2-way set associative (LRU)
 256 entries, 32-byte block length
 Cache-double-mode (16-kbyte cache)
 Index mode
• Operand cache (OC)
 32-kbyte, 2-way set associative (LRU)
 512 entries, 32-byte block length
 Cache-double-mode (32-kbyte cache)
 Index mode
 RAM mode (16-kbyte cache + 16-kbyte RAM)
 Choice of write method (copy-back or write-through)
• Single-stage copy-back buffer, single-stage write-through buffer
• Cache memory contents can be accessed directly by address mapping
(usable as on-chip memory)
• Store queue (32 bytes * 2 entries)
Interrupt controller
(INTC)
• Nine independent external interrupts: NMI, IRL3 to IRL0, and IRQ7 to IRQ4
• 15-level signed external interrupts: IRL3 to IRL0
• On-chip peripheral module interrupts: Priority level can be set for each module
User break
controller (UBC)
• Supports debugging by means of user break interrupts
• Two break channels
• Address, data value, access type, and data size can all be set as break
conditions
• Supports sequential break function
Bus state
controller (BSC)
• Supports external memory access
• External memory space divided into seven areas, each of up to 64
Mbytes, with the following parameters settable for each area:
 Bus size (8, 16, or 32 bits)
 Number of wait cycles (hardware wait function also supported)
 SRAM, synchronous DRAM, or burst ROM
 Supports PCMCIA interface (only in little endian mode)
• Synchronous DRAM refresh functions:
 Programmable refresh interval
 Supports auto refresh mode and self-refresh mode
• Synchronous DRAM burst access function
• Big endian or little endian mode can be set
Direct memory
access controller
(DMAC)
• 8-channel physical address DMA controller
• Transfer data size: 8, 16, 32, or 64 bits, or 32 bytes
• Address modes:
 1-bus-cycle single address mode
 2-bus-cycle dual address mode
• Transfer requests: External, peripheral module, or auto-requests
• Choice of DACK or DRAK (four external pins)
• Bus modes: Cycle-steal or burst mode
• Supports on-chip FIFO bridge (16-stage * 32-bit FIFO * 7) to achieve high-speed transfer for HAC/SSI, USB and LCDC
Timer unit (TMU) • 3-channel auto-reload 32-bit timer
• Input-capture function (only channel 2)
• Choice of six types counter input clocks (external and peripheral clocks)
Compare match
timer (CMT)
• 4-channel auto-reload 32-bit timers
• Choice of 16 or 32 bits
• Choice of 1-shot or free-running operation
• Choice of an interrupt source or DMA transfer request from compare match or overflow
Serial
communication
interface
(SCIF)
• Three full-duplex communications channels
• On-chip 128-byte FIFOs for all channels
• Choice of asynchronous mode or synchronous mode
• Can select any bit rate generated by on-chip baud-rate generator
• On-chip modem control function (SCIF_RTS and SCIF_CTS) for channel
1 and 2
Hitachi audio codec
interface (HAC)
• Digital interface for audio codec
• Supports transfer for slot 1 to slot 4
• Choice of 16- or 20-bit DMA transfer
• Supports various sampling rates by adjusting slot data
• Generates interrupt: data ready, data request, overflow, and underrun
Serial sound
interface (SSI)
• 2-channel bi-directional transfer (maximum)
• Support multi-channel and compressed-data transfer
• Selectable frame size
I2C bus interface
(I2C)
• 2 channels (maximum)
• Master/slave
• 16-byte FIFO
• Supports high-speed mode (400 kbits/sec)
• Supports version 1.0
Multimedia card
interface (MMCIF)
• Supports MMC mode
• A maximum bit rate of 20 Mbps at 20 MHz of peripheral clock
• Interface with MCCLK output for transfer clock output, MCCMD I/O for
command output/response input, MCDAT I/O (data I/O)
• Four interrupt sources
Smart card interface
(SIM)
• Supports ISO/IEC7816-3 (Identification card)
• Asynchronous half-duplex transfer (8 bits)
• Can select any bit rate generated by on-chip baud-rate generator
• Generates and checks parity bit
• Four interrupt sources
Hitachi controller
area network 2
(HCAN2)
• 2 channels (maximum)
• Supports CAN specification 2.0A and 2.0B
 Standard data and remote frame (11-bit ID)
 Extended data and remote frame (29-bit ID)
• 32 independent message buffers using standard (11-bit) and extended
(29-bit) ID format
• 31 Mailboxes can be used for transmission or reception
• One Mailbox can be used for only reception
• Message reception filtering by IDs:
 Standard message ID
 Extended message ID
• Local reception filter for reception-only Mailbox (standard and extended
message ID) can be specified
• Power-down sleep mode
• A maximum of 1-Mbit/s CAN data transfer rate can be specified
• Transmit message queue having internal priority sorting mechanism which
handle priority-inversion issue of real time applications
• Data buffer access without hand-shaking
Serial peripheral
interface (HSPI)
• 1 channel
• Master/slave mode
• Selectable bit rate generated by on-chip baud-rate generator
Multifunctional
interface (MFI)
• 2-kbyte internal memory can be read from or written to via the MFI pin in
32-bit units or by the CPU in 8-/16-/32-bit units.
• Choice of 8- or 16-bit parallel interface
• Supports 68-/80-family interface (can be switched during reset)
• Endians can be switched
USB host • 1 channel
• Supports USB version 1.1 and OHCI 1.0
• Supports data transfer rate of 1.5 Mbps and 12Mbps
• On-chip 8-kbyte SRAM as shared memory defined in OHCI specification
LCD controller
(LCDC)
• Supports 16 * 1 to 1024 * 1024 dots (8 bpp: a maximum of 640 *480
dots, 16 bpp: a maximum of 400 * 240 dots)
• Supports 4, 8, 15, and 16 bpp color modes
• Supports 1, 2, 4, and 6 bpp grayscale modes.
• Supports TFT/DSTN/STN display
• Selectable signal polarities
• 24-bit color palette memory (16 bits of 24 bits are valid: R: 5/G: 6/B: 5)
• Unified graphics memory architecture
A/D converter (ADC) • 10-bit resolution
• 4-channel input
• Three types of conversion modes
 Single mode: 1-channel A/D conversion
 Multi mode: 1- to 4-channel A/D conversion
 Scan mode: 1- to 4-channel A/D conversion
• Conversion time: 8 s for are channel (maximum)
• Absolute error ± 4LSB
General I/O (GPIO) • 70 general I/O port (69 for I/O and one for output)





Specifications

Item
Symbol
Value
Unit
I/O, CPG, ADC, USB power
supply voltage
VDDQ
VDD-CPG
AVCC-AD
−0.3 to 4.6



V
Internal power supply voltage
VDD
VDD-PLL1/2/3
−0.3 to 2.1
V
Input voltage
Vin
−0.3 to VDDQ+0.3, −0.5 to 5.5*1
V
Operating temperature
Topr
−40 to 85
Storage temperature
Tstg
−55 to 125
Notes: 1. The LSI may be permanently damaged if the maximum ratings are exceeded.
2. The LSI may be permanently damaged if any of the VSS pins are not connected to GND.
3. For the powering-on and powering-off sequence, see Appendix F, Power-On and
Power-Off Procedures.
*1 For I2C0_SCL, I2C0_SDA, I2C1_SCL, I2C1_SDA.





Description






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