HCPL2231

PinoutDescriptionHCPL2231 is a kind of opticallycoupled logic gate. It contains a GaAsP LED. The typical applications include isolation of high speed logic systems, computer-peripheral interfaces, microprocessor system interfaces, ground loop elimination, pulse transformer replacement, high speed ...

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SeekIC No. : 004359762 Detail

HCPL2231: PinoutDescriptionHCPL2231 is a kind of opticallycoupled logic gate. It contains a GaAsP LED. The typical applications include isolation of high speed logic systems, computer-peripheral interfaces, m...

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Part Number:
HCPL2231
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/6/2

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Description

HCPL2231 is a kind of opticallycoupled logic gate. It contains a GaAsP LED. The typical applications include isolation of high speed logic systems, computer-peripheral interfaces, microprocessor system interfaces, ground loop elimination, pulse transformer replacement, high speed line receiver and power control systems.

There are some features of HCPL2231 as follows. First is wide operating VCC range which is from 4.5 to 20 Volts. The second is 300 ns propagation delay guaranteed over the full temperature range. Then is 5 Mbd typical signal rate. Next is low input current which is from 1.6 mA to 1.8 mA. The fifth is hysteresis. The sixth is totem pole output (no pullup resistor required). The seventh is available in 8-Pin DIP, SOIC-8, widebody packages. The last one is guaranteed performance from -40 to 85.

What comes next is about the absolute maximum ratings of HCPL2231. The storage temperature (TS) is from -55 to 125. The operating temperature (TA) is from -40 to 85. The maximum average forward input current (IF(AVG)) is 10 mA. The peak transient input current (1 s Pulse Width, 300 pps) (IF(TRAN)) is 1.0 A. The reverse input voltage (VR) is 5 V. The average output current (IO) is 25 mA. The supply voltage (VCC) is from 0 to 20 V. The output voltage (VO) is from -0.5 to 20 V. The total package power dissipation (PT) is 210 mW. The lead solder temperature (through hole parts only) is 260 for 10 sec., 1.6 mm below seating plane.
 




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