HCPL-M701

Maximum Reverse Diode Voltage : 5 V
Minimum Operating Temperature : - 40 C
Packaging : Tube
Maximum Forward Diode Voltage : 1.7 V
Maximum Input Diode Current : 20 mA
Maximum Power Dissipation : 100 mW
Package / Case : SOIC-5
Maximum Operating Temperature : + 85 C
Maximum Baud Rate : 100 KBps
Current Transfer Ratio : 3500 %


Features:

• Surface Mountable
• Very Small, Low Profile JEDEC Registered Package Outline
• Compatible with Infrared Vapor Phase Reflow and Wave Soldering Processes
• High Current Transfer Ratio - 2000%
• Low Input Current Capability - 0.5 mA
• TTL Compatible Output - V_OL = 0.1 V
• Guaranteed ac and dc Performance Over Temperature: 0°C to 70°C
• High Output Current - 60 mA
• Recognized under the Component Program of U.L. (File No. E55361) for Dielectric Withstand Proof Test Voltage of 3750 Vac, 1 Minute
• Lead Free Option "-000E"




Application

• Ground Isolate Most Logic Families - TTL/TTL, CMOS/ TTL, CMOS/CMOS, LSTTL/ TTL, CMOS/LSTTL
• Low Input Current Line Receiver
• EIA RS232C Line Receiver
• Telephone Ring Detector
• ac Line Voltage Status Indicator - Low Input Power Dissipation
• Low Power Systems - Ground Isolation




Specifications

(No Derating Required up to 85°C)
Storage Temperature .......................................... -55°C to +125°C
Operating Temperature ......................................... -40°C to +85°C
Average Input Current - I_F ...................................................... 20 mA
Peak Input Current - I_F ............................................................40 mA
(50% duty cycle, 1 ms pulse width)
Peak Transient Input Current - I_F ............................................ 1.0 A
(1 µs pulse width, 300 pps)
Reverse Input Voltage - V_R ......................................................... 5 V
Input Power Dissipation ........................................................ 35 mW
Output Current - IO (Pin 5) .................................................... 60 mA
Supply and Output Voltage - V_CC (Pin 6-4),V_O (Pin 5-4)
HCPL-M700................................................................. -0.5 V to 7 V
HCPL-M701............................................................... -0.5 V to 18 V
Output Power Dissipation ................................................... 100 mW
Infrared and Vapor Phase Reflow Temperature .............. see below




Description

This HCPL-M701 small outline, low input current, high gain optocoupler is a single channel device in a five lead miniature footprint. Its SO-5 JEDEC registered (MO-155) package outline does not require "thro\ugh holes" in a PCB. This package occupies approximately one-fourth the footprint area of the standard dual-in-line package. The lead profile is designed to be compatible with standard surface mount processes.

This HCPL-M701 high gain series optocoupler uses a Light Emitting Diode and an integrated high gain photodetector to provide extremely high current transfer ratio in between input and output. Separate pins for the photodiode and output stage results in TTL compatible saturation voltages and high speed operation. Where desired the VCC and VO terminals may be tied together to achieve conventional photodarlington operation.

HCPL-M701 is for use in CMOS, LSTTL or other low power applications. A 400% minimum current transfer ratio is guaranteed over a 0-70 degrees C operating range for only 0.5 mA of LED current.Selection for lower input currents down to 250 mA is available upon request.

Parameters:

Technical/Catalog Information	HCPL-M701
Vendor	Avago Technologies US Inc.
Category	Isolators
Isolation Voltage	2500Vrms
Input Type	DC
Output Type	Darlington with Vcc
Current - Output/Channel	60mA
Voltage - Output	18V
Vce Saturation (Max)	-
Current Transfer Ratio (Min)	400% @ 500A
Mounting Type	Surface Mount
Package / Case	5-SOIC
Packaging	Tube
Number of Circuits	1 - Single
Lead Free Status	Contains Lead
RoHS Status	RoHS Non-Compliant
Other Names	HCPL M701 HCPLM701 516 1012 5 ND 51610125ND 516-1012-5