HCPL-625K

Current Transfer Ratio :
Maximum Reverse Diode Voltage :
Maximum Input Diode Current :
Packaging :
Maximum Forward Diode Voltage : 1.8 V
Minimum Operating Temperature : - 55 C
Maximum Operating Temperature : + 125 C
Maximum Baud Rate : 5 MBps
Maximum Power Dissipation : 200 mW
Package / Case : Flat-Pack 16


Description

The HCPL-625K is a four channel hermetically sealed optocoupler in a 16-Pin ceramic flat package with gold plated leads and the highest level of reliability, Class K.
The HCPL-625K is capable of operation and storage over the full military temperature range and may also be purchased as either commercial grade, with full MIL-PRF-38534 Class Level H testing or from the DSCC SMD 5962-88769. The HCPL-625K is manufactured and tested on a MIL-PRF-38534 certified line and is included in the DSCC Qualified Manufacturers List QML-38534 for Hybrid Microcircuits.
Each HCPL-625K channel contains an AlGaAs light emitting diode which is optically coupled to an integrated high gain photon detector. The detector has a threshold with hysteresis which provide differential mode noise immunity and eliminates the potential for output signal chatter. The detector in the single channel units has a tri-state output stage which allows for direct connection to data buses. The output is non-inverting. The detector IC has an internal shield that provides a guaranteed common mode transient immunity of up to 1000 V/micro-second. Improved power supply rejection eliminates the need for special power supply bypass precautions.
Package styles for this die set in one, two or four channels are 8-Pin DIP through hole, 16-Pin surface mount DIP flat pack, and 20 pad leadless ceramic chip carrier. Most HCPL-625K devices may be purchased with a variety of lead forms and plating options. See the datasheet for details.
Because the same electrical die (emitters and detectors) are used for each HCPL-625K channel of each device listed in the datasheet, absolute maximum ratings, recommended operating conditions, electrical specifications, and performance characteristics shown in the datasheet figures are virtually identical for all parts. Occasional exceptions exist due to package variations and limitations and are as noted. Additionally, the same package assembly processes and materials are used in all devices. These similarities give justification for the use of data obtained from one part to represent other parts performance for reliability and certain limited radiation test results.