HCPL-560X

Features: .Dual Marked with Device Part Number and DSCC Drawing Number.Manufactured and Tested on a MIL-PRF-38534 Certified Line.QML-38534, Class H and K.Five Hermetically Sealed Package Configurations.Performance Guaranteed over -55°C to +125°C.High Speed: 10 M Bit/s.CMR: > 10,000 V/s Typical....

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SeekIC No. : 004359775 Detail

HCPL-560X: Features: .Dual Marked with Device Part Number and DSCC Drawing Number.Manufactured and Tested on a MIL-PRF-38534 Certified Line.QML-38534, Class H and K.Five Hermetically Sealed Package Configurati...

floor Price/Ceiling Price

Part Number:
HCPL-560X
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/21

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Product Details

Description



Features:

. Dual Marked with Device Part Number and DSCC Drawing Number
. Manufactured and Tested on a MIL-PRF-38534 Certified Line
. QML-38534, Class H and K
. Five Hermetically Sealed Package Configurations
. Performance Guaranteed over -55°C to +125°C
. High Speed: 10 M Bit/s
. CMR: > 10,000 V/s Typical
. 1500 Vdc Withstand Test Voltage
. 2500 Vdc Withstand Test Voltage for HCPL-565X
. High Radiation Immunity
. 6N137, HCPL-2601, HCPL- 2630/-31 Function Compatibility
. Reliability Data
. TTL Circuit Compatibility Applications
. Military and Space
. High Reliability Systems
. Transportation, Medical, and Life Critical Systems
. Line Receiver
. Voltage Level Shifting
. Isolated Input Line Receiver
. Isolated Output Line Driver
. Logic Ground Isolation
. Harsh Industrial Environments
. Isolation for Computer,Communication, and Test Equipment Systems



Specifications

(No derating required up to +125°C)
Storage Temperature Range, TS..................................-65°C to +150°C
Operating Temperature, TA .........................................-55°C to +125°C
Case Temperature, TC ................................................................+170°C
Junction Temperature, TJ.............................................................+175°C
Lead Solder Temperature ............................................... 260°C for 10 s
Peak Forward Input Current, IFPK, (each channel,
1 ms duration) ...........................................................................40 mA
Average Input Forward Current, IFAVG (each channel)...................20 mA
Input Power Dissipation (each channel) ........................................35 mW
Reverse Input Voltage, VR (each channel)...........................................5 V
Supply Voltage, VCC (1 minute maximum) ...........................................7 V
Output Current, IO (each channel)..................................................25 mA
Output Power Dissipation (each channel) .....................................40 mW
Output Voltage, VO (each channel).....................................................7 V*
Package Power Dissipation, PD (each channel) ...........................200 mW



Description

These HCPL-560X units are single, dual and quad channel, hermetically sealed optocouplers. The HCPL-560X products are capable of operation and storage over the full military temperature range and can be purchased as either standard product or with full MIL-PRF-38534 Class Level Hor K testing or from the appropri- ate DSCC Drawing. All HCPL-560X devices are manufactured and tested on a MIL-PRF-38534 certified line and are included in the DSCC Quali- fied Manufacturers List QML- 38534 for Hybrid Microcircuits. Quad channel devices are available by special order in the16 pin DIP through hole packages.

Each HCPL-560X channel contains a GaAsP light emitting diode which is optically coupled to an integrated high speed photon detector. The output of the detector is an open collector Schottky clamped transistor. Internal shields provide a guaranteed common mode transient immunity specification of 1000 V/s. For Isolation Voltage applications requiring up to 2500 Vdc, the HCPL-5650 family is also available. Package styles for these parts are 8 and 16 pin DIP through hole (case outlines P andE respectively), and 16 pin surface mount DIP flat pack (case outline F), leadless ceramic chip carrier (case outline 2). Devices may be purchased with a variety of lead bend and plating options. See Selection Guide Table for details. Standard Microcircuit Drawing (SMD) parts are available for each package and lead style.

Because the same electrical die (emitters and detectors) are used for each HCPL-560X channel of each device listed in this data sheet, absolutemaximum ratings, recommended operating conditions, electrical specifications, and performance characteristics shown in the figures are identical for all parts. Occasional exceptions exist due to package variations and limitations, and are as noted. Additionally, the same package assembly processes and materials are used in all devices. These similarities give justification for the use of data obtained from one part to represent other parts' performance for reliability and certain limited radiation test results.




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