HCPL-268K

Current Transfer Ratio :
Maximum Input Diode Current :
Packaging :
Maximum Reverse Diode Voltage : 5 V
Maximum Forward Diode Voltage : 1.9 V
Minimum Operating Temperature : - 55 C
Maximum Baud Rate : 10 MBps
Maximum Operating Temperature : + 125 C
Maximum Power Dissipation : 200 mW
Package / Case : PDIP-16


Features:

.Dual Marked with Device Part Number and DSCC Drawing Number
.Manufactured and Tested on a MIL-PRF-38534 Certified Line
.QML-38534, Class H and K
.Five Hermetically Sealed Package Configurations
.Performance Guaranteed over -55°C to +125°C
.High Speed: 10 M Bit/s
.CMR: > 10,000 V/s Typical
.1500 Vdc Withstand Test Voltage
.2500 Vdc Withstand Test Voltage for HCPL-565X
.High Radiation Immunity
.6N137, HCPL-2601, HCPL- 2630/-31 Function Compatibility
.Reliability Data
.TTL Circuit Compatibility Applications
.Military and Space
.High Reliability Systems
.Transportation, Medical, and Life Critical Systems
.Line Receiver
.Voltage Level Shifting
.Isolated Input Line Receiver
.Isolated Output Line Driver
.Logic Ground Isolation
.Harsh Industrial Environments
.Isolation for Computer,Communication, and Test Equipment Systems




Specifications

(No derating required up to +125°C)
Storage Temperature Range, T_S..................................-65°C to +150°C
Operating Temperature, T_A .........................................-55°C to +125°C
Case Temperature, T_C ................................................................+170°C
Junction Temperature, T_J.............................................................+175°C
Lead Solder Temperature ............................................... 260°C for 10 s
Peak Forward Input Current, I_FPK, (each channel,
1 ms duration) ...........................................................................40 mA
Average Input Forward Current, I_FAVG (each channel)...................20 mA
Input Power Dissipation (each channel) ........................................35 mW
Reverse Input Voltage, V_R (each channel)...........................................5 V
Supply Voltage, V_CC (1 minute maximum) ...........................................7 V
Output Current, I_O (each channel)..................................................25 mA
Output Power Dissipation (each channel) .....................................40 mW
Output Voltage, V_O (each channel).....................................................7 V*
Package Power Dissipation, P_D (each channel) ...........................200 mW





Description

The HCPL-268K is a highest reliability Class K two channel hermetically sealed optocoupler in a 16-Pin ceramic DIP package with gold plated leads. Solder dipped leads and various lead form options are also available. See the datasheet for details.
The product is capable of operation and storage over the full military temperature range and may also be purchased as either commercial grade or with full MIL-PRF-38534 Class Level H or K testing from the appropriate DSCC SMD (5962-98001 for the Class K, 81028 for the Class H). All devices are manufactured and tested on a MIL-PRF-38534 certified line and the HCPL-268K is included in the DSCC Qualified Manufacturers List QML-38534 for Hybrid Microcircuits. Quad channel devices are available by special order in the 16-Pin DIP through-hole packages.
Each HCPL-268K channel contains a GaAsP light emitting diode which is optically coupled to an integrated high speed photon detector. The output of the detector is an open collector Schottky clamped transistor. Internal shields provide a guaranteed common mode transient immunity specification of 1000 V/micro-second. For Isolation Voltage applications requiring up to 2500 Vdc, the HCPL-5650 family is also available. Package styles for this die set in one, two, or four channels are 8 and 16-Pin DIP through hole, 16-Pin surface mount DIP flat pack, and 20 pad Leadless Ceramic Chip Carrier. Most devices may be purchased with a variety of lead forms and plating options. See the datasheet for details.
Because the same electrical die (emitters and detectors) are used for each channel of each device listed in the datasheet, absolute maximum ratings, recommended operating conditions, electrical specifications, and performance characteristics shown in the datasheet figures are virtually identical for all parts. Occasional exceptions exist due to package variations and limitations and are as noted. Additionally, the same package of HCPL-268K assembly processes and materials are used in all devices. These similarities give justification for the use of data obtained from one part to represent other parts performance for reliability and certain limited radiation test results.