High Speed Optocouplers 100kBd 1Ch 10mA
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Current Transfer Ratio : | 5000 % | Maximum Baud Rate : | 100 KBps | ||
Maximum Forward Diode Voltage : | 1.7 V | Maximum Reverse Diode Voltage : | 5 V | ||
Maximum Input Diode Current : | 20 mA | Maximum Power Dissipation : | 135 mW | ||
Maximum Operating Temperature : | + 70 C | Minimum Operating Temperature : | 0 C | ||
Package / Case : | SOIC-8 | Packaging : | Tube |
Parameter | Symbol | Min. | Max. | Units |
Storage Temperature | TS | 55 | 125 | ˚C |
Operating Temperature | TA | 40 | 85 | ˚C |
Average Forward Input Current | IF(AVG) | 20 | mA | |
Peak Forward Input Current (50% Duty Cycle, 1 ms Pulse Width) |
IF(PEAK) | 40 | mA | |
Peak Transient Input Current (< 1 µs Pulse Width, 300 pps) |
IF(TRAN) | 1.0 | A | |
Reverse Input Voltage | VR | 5 | V | |
Input Power Dissipation | PI | 35 | mW | |
Output Current (Pin 6) | IO | 60 | mA | |
Emitter Base Reverse Voltage (Pin 5-7) | VEB | 0.5 | V | |
Supply Voltage and Output Voltage | VCC | 0.5 | 7 | V |
Output Power Dissipation | PO | 100 | mW | |
Total Power Dissipation | PT | 135 | mW | |
Lead Solder Temperature (for Through Hole Devices) | 260˚C for 10 sec., 1.6 mm below seating plane. | |||
Reflow Temperature Profile (for SOIC-8 and Option #300) |
See Package Outline Drawings section. |
These HCPL-070L high-gain series optocouplers use a Light Emitting Diode and an integrated high gain photodetector to provide extremely high current transfer ratio between input and output. Separate pins for the photodiode and output stage result in LVTTL compatible saturation voltages and high speed operation.
Where desired, the VCC and VO terminals may be tied together to achieve photodarlington operation. A base access terminal allows a gain bandwidth adjustment to be made. These HCPL-070L optocouplers are for use in LVTTL/LVCMOS or other low power applications. A 400 percent minimum current transfer ratio is guaranteed over 0oC to 70oC operating range for only 0.5 mA of LED current.
The HCPL-070L is a surface mount device packaged in an industry standard SOIC-8 footprint. The SOIC-8 does not require "through holes" in a PCB. This package occupies approximately one-third the footprint area of the standard dual-in-line package. The lead profile is designed to be compatible with standard surface mount processes.
Technical/Catalog Information | HCPL-070L |
Vendor | Avago Technologies US Inc. |
Category | Isolators |
Isolation Voltage | 3750Vrms |
Input Type | DC |
Output Type | Darlington with Vcc |
Current - Output/Channel | 60mA |
Voltage - Output | 7V |
Vce Saturation (Max) | - |
Current Transfer Ratio (Min) | 400% @ 500A |
Mounting Type | Surface Mount |
Package / Case | 8-SOIC |
Packaging | Tube |
Number of Circuits | 1 - Single |
Lead Free Status | Contains Lead |
RoHS Status | RoHS Non-Compliant |
Other Names | HCPL 070L HCPL070L |