HC5520

Features: • Normal and Reversed DC Feed• Current Limited Loop Feed• Ringing, Test-In, and Test-Out Relay Drivers• Thermal Shutdown Protection with Alert Signal• On-Hook Transmission• Selectable Transmit and Receive Gain Setting• Selectable 2-Wire Impedance...

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HC5520 Picture
SeekIC No. : 004359424 Detail

HC5520: Features: • Normal and Reversed DC Feed• Current Limited Loop Feed• Ringing, Test-In, and Test-Out Relay Drivers• Thermal Shutdown Protection with Alert Signal• On-Hook...

floor Price/Ceiling Price

Part Number:
HC5520
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/24

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Product Details

Description



Features:

• Normal and Reversed DC Feed
• Current Limited Loop Feed
• Ringing, Test-In, and Test-Out Relay Drivers
• Thermal Shutdown Protection with Alert Signal
• On-Hook Transmission
• Selectable Transmit and Receive Gain Setting
• Selectable 2-Wire Impedance Matching
• Zero Crossing Ring Trip Detection and Ring Relay Release
• Parallel Digital Control and Status Monitoring
• Protection Resistors Inside Feedback Loop Allows the Use of PTC Devices Without Impact on Longitudinal Balance
• Thermal Management Features



Application

• CO/PABX Line Circuits


Specifications

VCC to AGND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
VEE to AGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -7V
VBAT to BGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80V
AGND to BGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±3V
Digital Pins to AGND . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
ESD Withstand (Human Body Model) . . . . . . . . . . . . . . . . . . . 500V



Description

The HC5520 is a Monolithic Subscriber Line Interface Circuit (SLIC) for Analog Subscriber Line cards in Central Office and PABX switches.

The HC5520 provides a comprehensive set of features for these applications including loop reversal, zero crossing ringing relay operation, long loop drive and a mutually independent setting of the receive and transmit gains, and the two wire impedance  synthesis. Advanced power management features combined with a small 44 lead MQFP package allow significant board space to be freed up for additional line circuits.

The HC5520 is fabricated in a Harris state-of-the-art Bonded Wafer High Voltage process, providing freedom from traditional JI latch-up phenomena without the use of additional power supply filtering components or substrate tie connections. The very low parasitics and leakages associated with this process provide an exceptionally flat performance over frequency and temperature.


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