HBM08DSXN, US $ 3.19-3.19, HBM08DSXN DataSheet download, circuit diagram from SeekIC.com

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SeekIC No. : 003134000 Detail

HBM08DSXN: CONN EDGECARD 16POS DIP .156 SLD

HBM08DSXN Data Sheet

US $ 3.19~3.19 / Piece | Get Latest Price

Part Number:: HBM08DSXN
Mfg:
Supply Ability:: 5000

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$3.19

Processing time
15 Days

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Upload time: 2024/12/21

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Recent History
What is this?

HBM02DRAN evaluate
US $2.48 - 2.48 / Piece

CONN EDGECARD 4POS R/A .156 SLD
HBM02DRKN evaluate
US $2.22 - 2.22 / Piece

CONN EDGECARD 4POS DIP .156 SLD
HBM02DRKN-S13 evaluate
US $2.34 - 2.34 / Piece

CONN EDGECARD 4POS .156 EXTEND

Product Details

Quick Details

Series:	-	Manufacturer:	Sullins Connector Solutions
Card Type:	Non Specified - Dual Edge	Gender:	Female
Number of Positions/Bay/Row:	8	Gate-Emitter Leakage Current :	0.4 uA
Number of Positions:	16	Card Thickness:	0.062" (1.57mm)
Number of Rows:	2	Pitch:	0.156" (3.96mm)
Features:	-	Mounting Type:	Through Hole
Termination:	Solder	Contact Material:	Beryllium Copper
Contact Finish:	Gold	Contact Finish Thickness:	10µin (0.25µm)
Contact Type:	Full Bellows	Color:	Blue
Packaging:	Tray

Description

Gender: Female
Number of Rows: 2
Features: -
Mounting Type: Through Hole
Termination: Solder
Contact Finish: Gold
Flange Feature: -
Card Type: Non Specified - Dual Edge
Card Thickness: 0.062" (1.57mm)
Packaging: Tray
Series: -
Pitch: 0.156" (3.96mm)
Number of Positions: 16
Manufacturer: Sullins Connector Solutions
Contact Finish Thickness: 10µin (0.25µm)
Contact Type: Full Bellows
Color: Blue
Number of Positions/Bay/Row: 8
Contact Material: Beryllium Copper

Parameters:

Technical/Catalog Information	HBM08DSXN
Vendor	Sullins Connector Solutions
Category	Connectors
Card Thickness	0.062" (1.57mm)
Card Type	Dual Edge
Contact Finish	Gold
Mounting Type	Through Hole
Features	-
Number of Positions	16
Number of Rows	1
Pitch	0.156" (3.96mm)
Packaging	Tray
Color	Blue
Contact Finish Thickness	10in (0.25m)
Gender	Female
Lead Free Status	Lead Free
RoHS Status	RoHS Compliant
Other Names	HBM08DSXN HBM08DSXN

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HBM08DSXN

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