Features: • 184-pin socket type package (dual lead out) Outline: 133.35mm (Length) * 43.18mm (Height) *4.80mm (Thickness) Lead pitch: 1.27mm• 2.5V power supply (VCC/VCCQ)• SSTL-2 interface for all inputs and outputs• Clock frequency: 143MHz/133MHz/125MHz (ma...
HB54R1G9F2-10B: Features: • 184-pin socket type package (dual lead out) Outline: 133.35mm (Length) * 43.18mm (Height) *4.80mm (Thickness) Lead pitch: 1.27mm• 2.5V power supply (VCC/VCCQ)...
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DescriptionThe HB54A1288KM is a 16M x 64 x 1 bank Double Data Rate (DDR) SDRAM Module, mounted 4 p...
DescriptionThe HB54A2568FM is Double Data Rate (DDR) SDRAM Module, mounted 256M bits DDR SDRAM (HM...
Features: • 200-pin socket type package (dual lead out) Outline: 67.6mm (Length) × 31.75mm (...
Parameter |
Symbol |
Value |
Unit |
Note |
Voltage on any pin relative to VSS |
VT |
1.0 to +4.6 |
V |
1 |
Supply voltage relative to VSS |
VCC,VCCQ |
1.0 to +4.6 |
V |
1 |
Short circuit output current |
Iout |
50 |
mA |
|
Power dissipation |
PT |
18.0 |
W |
|
Operating temperature |
Topr |
0 to +55 |
°C |
|
Storage temperature |
Tstg |
50 to +100 |
°C |
The HB54R1G9F2 is a 128M × 7 2 × 2 bank Double Data Rate (DDR) SDRAM Module, mounted 36 pieces of 256Mbits DDR SDRAM (HM5425401BTB) sealed in TCP package, 1 piece of PLL clock driver, 2 pieces of register driver and 1 piece of serial EEPROM (2k bits EEPROM) for Presence Detect (PD). Read and write operations are performed at the cross points of the CK and the /CK. This high-speed data transfer is realized by the 2-bit prefetch-pipelined architecture. Data strobe (DQS) both for read and write are available for high speed and reliable data bus design. By setting extended mode register, the on-chip Delay Locked Loop (DLL) can be set enable or disable. An outline of the products is 184-pin socket type package (dual lead out). Therefore, it makes high density mounting possible without surface mount technology. HB54R1G9F2 provides common data inputs and outputs. Decoupling capacitors are mounted beside each TCP on the module board.
Note of HB54R1G9F2: Do not push the cover or drop the modules in order to protect from mechanical defects, which would be electrical defects.