Series: -
Sensing Distance: 0.118" (3mm)
Sensing Method: Transmissive
Mounting Type: Through Hole
Package / Case: PCB Mount
Packaging: Tube
Current - DC Forward (If): 50mA
Output Configuration: Photodarlington
Manufacturer: Fairchild Optoelectronics Group
Current - Collector (Ic) (Max): 40mA
Response Time: 7µs, 45µs
Voltage - Collector Emitter Breakdown (Max): 55V
Features: • Opaque housing
• Low cost
• 035" apertures
• High I C(ON)Specifications
|
Parameter |
Symbol |
Rating |
Unit |
|
Operating Temperature |
T OPR |
-55 to +100 |
°C |
|
Storage Temperature |
T STG |
-55 to +100 |
°C |
|
Soldering Temperature (Iron)
(2,3 and 4) |
T SOL-I |
240 for 5 sec |
°C |
|
Soldering Temperature (Flow) (2 and 3) |
T SOL-F |
260 for 10 sec |
°C |
|
INPUT (EMITTER)
Continuous Forward Current |
I F |
50 |
mA |
|
Reverse Voltage |
V R |
6 |
V |
|
Power Dissipation (1) |
P D |
100 |
mW |
|
OUTPUT (SENSOR)
Collector to Emitter Voltage |
V CEO |
55 |
V |
|
Emitter to Collector Voltage |
V ECO |
6 |
V |
|
Collector Current |
I C |
40 |
mA |
|
Power Dissipation (T C = 25°C)
(1) |
P D |
150 |
mW |
NOTES:
1. Derate power dissipation linearly 1.33 mW/°C above 25°C.
2. RMA flux is recommended.
3. Methanol or isopropyl alcohols are recommended as cleaning agents.
4. Soldering iron 1/16" (1.6 mm) minimum from housing.DescriptionThe H22B4, H22B5 and H22B6 consist of a gallium arsenide infrared emitting diode coupled with a silicon photodarlington in a plastic housing. The packaging system of H22B4, H22B5 and H22B6 is designed to optimize the mechanical resolution, coupling efficiency, ambient light rejection, cost and reliability. The gap in the housing provides a means of interrupting the signal with an opaque material, switching the output from an "ON" to an "OFF" state.
Parameters: | Technical/Catalog Information | H22B4 |
| Vendor | Fairchild Semiconductor |
| Category | Sensors, Sensor Evaluation Kits |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | H22B4
H22B4
|
H22B4 Data Sheet
