Features: • MOSFETs in trench technology:- low RDSon- optimized intrinsic reverse diode• package:- high level of integration- high current capability- auxiliary terminals for MOSFET control- terminals for soldering or welding connections- isolated DCB ceramic base plate with optimized ...
GWM 70-01P2: Features: • MOSFETs in trench technology:- low RDSon- optimized intrinsic reverse diode• package:- high level of integration- high current capability- auxiliary terminals for MOSFET cont...
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