Features: • FRD included between emitter and collector• Enhancement mode type• High speed IGBT : tf = 0.25 s (typ.) (IC = 40 A) FRD : trr = 0.7 s (typ.) (di/dt = −20 A/s)• Low saturation voltage: VCE (sat) = 3.7 V (typ.) (IC = 40 A)Specifications Characteristics ...
GT40T301: Features: • FRD included between emitter and collector• Enhancement mode type• High speed IGBT : tf = 0.25 s (typ.) (IC = 40 A) FRD : trr = 0.7 s (typ.) (di/dt = −20 A/s)R...
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Characteristics | Symbol | Rating | Unit | |
Collector-emitter voltage | VCES | 1500 | V | |
Gate-emitter voltage | VGES | ±25 | V | |
Collector current | DC | IC | 40 | A |
1 ms | ICP | 80 | A | |
Emitter-collector forward current |
DC | IECF | 30 | A |
1 ms | IECPF | 80 | A | |
Collector power dissipation (Tc = 25°C) |
PC | 200 | W | |
Junction temperature | Tj | 150 | ||
Storage temperature range | Tstg | −55~150 |
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the ignificant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).