Features: `Third-generation IGBT`Enhancement mode type`High speed : tf = 0.30s (Max.) (IC = 10A)`Low saturation voltage : VCE (sat) = 2.7V (Max.) (IC = 10A)`FRD included between emitter and collector`Third-generation IGBT`Enhancement mode type`High speed : tf = 0.30s (Max.) (IC = 10A)`Low saturati...
GT10J303: Features: `Third-generation IGBT`Enhancement mode type`High speed : tf = 0.30s (Max.) (IC = 10A)`Low saturation voltage : VCE (sat) = 2.7V (Max.) (IC = 10A)`FRD included between emitter and collecto...
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DescriptionThe GT100DA120U is designed as one kind of insulated gate bipolar transistors (trench I...
DescriptionThe GT100DA60U is designed as one kind of insulated gate bipolar transistors (trench IG...
CHARACTERISTIC |
SYMBOL |
RATING |
UNIT | |
Collector−Emitter Voltage |
VCES |
600 |
V | |
Gate-Emitter Voltage |
VGES |
±20 |
V | |
Collector Current |
DC |
IC |
10 |
A |
1ms |
ICP |
20 |
A | |
Emitter−Collector Forward Current |
DC |
IF |
10 |
A |
1ms |
IFM |
20 |
A | |
Collector Power Dissipation (Tc = 25°C) |
PC |
30 |
W | |
Junction Temperature |
Tj |
150 |
||
Storage Temperature Range |
Tstg |
−55~150 |
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
CHARACTERISTIC |
SYMBOL |
RATING |
UNIT | |
Collector−Emitter Voltage |
VCES |
600 |
V | |
Gate-Emitter Voltage |
VGES |
±20 |
V | |
Collector Current |
DC |
IC |
10 |
A |
1ms |
ICP |
20 |
A | |
Emitter−Collector Forward Current |
DC |
IF |
10 |
A |
1ms |
IFM |
20 |
A | |
Collector Power Dissipation (Tc = 25°C) |
PC |
30 |
W | |
Junction Temperature |
Tj |
150 |
||
Storage Temperature Range |
Tstg |
−55~150 |
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).