Features: ·Planar Die construction·500mW Power Dissipation·Ideally Suited for Automated Assembly ProcessesSpecifications Parameter Symbol Value Units Power Dissipation at Tamb = 25 PTOT 500 mW Junction Temperature TJ 175 Storage Temperature Range TS -65 to +175 Vali...
GQZ2.0: Features: ·Planar Die construction·500mW Power Dissipation·Ideally Suited for Automated Assembly ProcessesSpecifications Parameter Symbol Value Units Power Dissipation at Tamb = 25 PTOT...
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Parameter | Symbol | Value | Units |
Power Dissipation at Tamb = 25 | PTOT | 500 | mW |
Junction Temperature | TJ | 175 | |
Storage Temperature Range | TS | -65 to +175 | |
Valid provided that leads at a distance of 10mm from case are kept at ambient temperature. |