GQZ2.0

Features: ·Planar Die construction·500mW Power Dissipation·Ideally Suited for Automated Assembly ProcessesSpecifications Parameter Symbol Value Units Power Dissipation at Tamb = 25 PTOT 500 mW Junction Temperature TJ 175 Storage Temperature Range TS -65 to +175 Vali...

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GQZ2.0 Picture
SeekIC No. : 004355236 Detail

GQZ2.0: Features: ·Planar Die construction·500mW Power Dissipation·Ideally Suited for Automated Assembly ProcessesSpecifications Parameter Symbol Value Units Power Dissipation at Tamb = 25 PTOT...

floor Price/Ceiling Price

Part Number:
GQZ2.0
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Month Sales

268 Transactions

Rating

evaluate  (4.8 stars)

Upload time: 2024/11/23

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Product Details

Description



Features:

·Planar Die construction
·500mW Power Dissipation
·Ideally Suited for Automated Assembly Processes



Specifications

Parameter Symbol Value Units
Power Dissipation at Tamb = 25 PTOT 500 mW
Junction Temperature TJ 175
Storage Temperature Range TS -65 to +175
Valid provided that leads at a distance of 10mm from case are kept at ambient temperature.



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